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1.发明授权公开(公告)号：US09522468B2
公开(公告)日：2016-12-20
申请号：US14273298
申请日：2014-05-08
发明人： Paul Argus Parks , Nile Alexander Light , Stephen P. Bathurst , John A. Higginson , Andreas Bibl
CPC分类号： B25J7/00 , B25J9/0015 , B25J18/007 , H01L2224/7565 , H01L2224/75822 , Y10T74/20354
摘要： Systems and methods for transferring a micro device or an array of micro devices to or from a substrate are disclosed. In an embodiment, a remote center robot allows on-the-fly alignment between a micro pick up array and a target substrate. The remote center robot may include a plurality of symmetric linkages that move independently and share a remote rotational center. In an embodiment, the remote rotational center may be positioned at a surface of the micro pick up array to prevent damage to the array of micro devices during transfer.
摘要翻译： 公开了用于将微器件或微阵列阵列转移到衬底或从衬底传送微阵列的系统和方法。 在一个实施例中，远程中心机器人允许微拾取阵列和目标基板之间的即时对准。 远程中心机器人可以包括独立移动并共享远程旋转中心的多个对称联动。 在一个实施例中，远程旋转中心可以定位在微拾取阵列的表面处，以防止在传送期间损坏微器件阵列。
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公开(公告)号：US09511498B2
公开(公告)日：2016-12-06
申请号：US14852366
申请日：2015-09-11
CPC分类号： B25J15/0085 , B81C99/002 , H01L21/67132 , H01L21/67144 , H01L21/67259 , H01L24/75 , H01L24/95 , H01L2224/75251 , H01L2224/75252 , H01L2224/75753 , H01L2224/7598 , H02N13/00
摘要： Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool includes an articulating transfer head assembly, a carrier substrate holder, and an actuator assembly to adjust a spatial relationship between the articulating transfer head assembly and the carrier substrate holder. The articulating transfer head assembly may include an electrostatic voltage source connection and a substrate supporting an array of electrostatic transfer heads.
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公开(公告)号：US20160094160A1
公开(公告)日：2016-03-31
申请号：US14502994
申请日：2014-09-30
IPC分类号： H02N13/00
CPC分类号： B81C99/002 , H01H59/0009 , H01L41/113
摘要： A compliant electrostatic transfer head and method of forming a compliant electrostatic transfer head are described. In an embodiment, a compliant electrostatic transfer head includes a base substrate, a cavity template layer on the base substrate, a first confinement layer between the base substrate and the cavity template layer, and a patterned device layer on the cavity template layer. The patterned device layer includes an electrode that is deflectable toward a cavity in the cavity template layer. In an embodiment, a second confinement layer is between the cavity template layer and the patterned device layer.
摘要翻译： 描述了柔性静电转印头和形成顺应性静电转印头的方法。 在一个实施例中，顺应性静电转印头包括基底衬底，在基底衬底上的空腔模板层，在基底衬底和腔模板层之间的第一限制层，以及腔模板层上的图案化器件层。 图案化器件层包括能够朝向空腔模板层中的空腔偏转的电极。 在一个实施例中，第二限制层位于空腔模板层和图案化器件层之间。
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公开(公告)号：US20140061687A1
公开(公告)日：2014-03-06
申请号：US14071106
申请日：2013-11-04
IPC分类号： H01L33/08
CPC分类号： H01L33/08 , H01L21/67144 , H01L24/75 , H01L24/83 , H01L24/95 , H01L27/156 , H01L33/0079 , H01L33/405 , H01L2224/7598 , H01L2224/83 , H01L2224/95145 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/00
摘要： A method of fabricating and transferring a micro device and an array of micro devices to a receiving substrate are described. In an embodiment, an electrically insulating layer is utilized as an etch stop layer during etching of a p-n diode layer to form a plurality of micro p-n diodes. In an embodiment, an electrically conductive intermediate bonding layer is utilized during the formation and transfer of the micro devices to the receiving substrate.
摘要翻译： 描述了将微器件和微器件阵列制造和传送到接收衬底的方法。 在一个实施例中，在蚀刻p-n二极管层以形成多个微p-n二极管期间，电绝缘层被用作蚀刻停止层。 在一个实施例中，在将微器件形成和传送到接收衬底期间，使用导电中间接合层。
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公开(公告)号：US09741592B2
公开(公告)日：2017-08-22
申请号：US14466497
申请日：2014-08-22
发明人： Hsin-Hua Hu , Andreas Bibl , John A. Higginson
IPC分类号： H01L27/15 , H01L33/00 , H01L21/52 , H01L21/683 , H01L23/00 , H01L25/075 , H01L25/00
CPC分类号： H01L21/52 , H01L21/6835 , H01L21/6836 , H01L24/83 , H01L24/93 , H01L24/95 , H01L25/0753 , H01L25/50 , H01L27/156 , H01L33/0079 , H01L33/40 , H01L2221/6835 , H01L2224/95136 , H01L2924/12041 , H01L2924/12042 , H01L2924/1461 , H01L2924/00
摘要： A method and structure for stabilizing an array of micro devices is disclosed. The array of micro devices is formed on an array of stabilization posts formed from a thermoset material. Each micro device includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface.
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公开(公告)号：US09589944B2
公开(公告)日：2017-03-07
申请号：US15008372
申请日：2016-01-27
发明人： John A. Higginson , Andreas Bibl , Hsin-Hua Hu
IPC分类号： H01L29/06 , H01L25/16 , H01L33/44 , H01L23/31 , H01L33/06 , H01L33/00 , H01L33/42 , H01L33/62 , H01L25/075 , H01L27/12 , H01L21/56
CPC分类号： H01L25/167 , H01L21/56 , H01L23/3171 , H01L25/0753 , H01L25/50 , H01L27/1214 , H01L27/1248 , H01L27/1262 , H01L33/005 , H01L33/06 , H01L33/42 , H01L33/44 , H01L33/54 , H01L33/62 , H01L2924/0002 , H01L2933/0016 , H01L2933/0025 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/00
摘要： A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.
摘要翻译： 公开了一种用于在接收基板上接收微型装置的方法和结构。 诸如微型LED器件的微器件通过覆盖接收衬底上的导电层的钝化层穿孔，并且钝化层硬化。 在一个实施例中，微型LED器件通过B阶热固性材料穿孔。 在一个实施例中，微型LED器件穿过热塑性材料。
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公开(公告)号：US09463613B2
公开(公告)日：2016-10-11
申请号：US14307321
申请日：2014-06-17
IPC分类号： B29C65/50 , B32B43/00 , B32B38/18 , B32B37/00 , B30B5/00 , B30B15/34 , H01L23/00 , H01L21/67
CPC分类号： H01L29/167 , B32B38/18 , H01L21/67144 , H01L24/75 , H01L24/83 , H01L24/95 , H01L24/97 , H01L25/0753 , H01L33/62 , H01L2224/75725 , H01L2224/7598 , H01L2224/83005 , H01L2224/97 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/1421 , H01L2924/1431 , H01L2924/1434 , H01L2924/1461 , H01L2933/0066 , Y10T156/1153 , Y10T156/17 , Y10T156/1705 , Y10T156/1707 , Y10T156/1744 , Y10T156/1749 , Y10T156/1776 , Y10T156/1911 , H01L2224/83 , H01L2924/00
摘要： A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.
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公开(公告)号：US20160176045A1
公开(公告)日：2016-06-23
申请号：US15054977
申请日：2016-02-26
IPC分类号： B25J9/10 , B25J15/00 , H01L23/00 , H01L21/677 , H01L21/68 , B25J7/00 , H01L21/683
CPC分类号： B25J9/1015 , B25J7/00 , B25J9/0015 , B25J15/0052 , B25J15/0085 , B25J17/0208 , H01L21/67144 , H01L21/67721 , H01L21/68 , H01L21/6833 , H01L24/75 , H01L24/95 , H01L2224/75251 , H01L2224/75252 , H01L2224/75282 , H01L2224/7565 , H01L2224/75723 , H01L2224/75725 , H01L2224/75823 , H01L2224/759 , H01L2224/75901 , H01L2224/7592 , H01L2224/7598 , H01L2224/75984 , H01L2924/12041 , H01L2924/12042 , H01L2924/1461 , H01L2924/00
摘要： Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices.
摘要翻译： 公开了用于从载体衬底传送微器件的系统和方法。 在一个实施例中，质量传递工具操纵器组件允许在微拾取阵列上的静电转印头阵列和载体衬底上的微器件阵列之间的主动对准。 可以检测质量传递工具操纵器组件的柔性元件的位移，以控制静电转印头阵列与微器件阵列之间的对准。
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公开(公告)号：US20150364424A1
公开(公告)日：2015-12-17
申请号：US14307325
申请日：2014-06-17
IPC分类号： H01L23/538 , H01L21/768
CPC分类号： H01L23/5384 , B81C99/002 , H01L21/76898 , H01L24/75 , H01L24/95
摘要： A compliant electrostatic transfer head and method of forming a compliant electrostatic transfer head are described. In an embodiment, a compliant electrostatic transfer head includes a cavity in a base substrate, a spring support layer on the base substrate, and a patterned device layer on the spring support layer. The spring support layer includes a spring support layer beam profile that extends over and is deflectable toward the cavity, and the patterned device layer includes an electrode beam profile that is supported by the spring support layer beam profile and extends over and is deflectable toward the cavity.
摘要翻译： 描述了柔性静电转印头和形成顺应性静电转印头的方法。 在一个实施例中，顺应性静电转印头包括基底衬底中的空腔，在基底衬底上的弹簧支撑层，以及弹簧支撑层上的图案化器件层。 弹簧支撑层包括弹簧支撑层梁轮廓，该弹性支撑层梁型材向空腔延伸并且可偏转，并且图案化的装置层包括由弹簧支撑层梁轮廓支撑并且朝向腔体可偏转的电极梁轮廓 。
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10.发明申请公开(公告)号：US20150321338A1
公开(公告)日：2015-11-12
申请号：US14273298
申请日：2014-05-08
发明人： Paul Argus Parks , Nile Alexander Light , Stephen P. Bathurst , John A. Higginson , Andreas Bibl
IPC分类号： B25J7/00
CPC分类号： B25J7/00 , B25J9/0015 , B25J18/007 , H01L2224/7565 , H01L2224/75822 , Y10T74/20354
摘要： Systems and methods for transferring a micro device or an array of micro devices to or from a substrate are disclosed. In an embodiment, a remote center robot allows on-the-fly alignment between a micro pick up array and a target substrate. The remote center robot may include a plurality of symmetric linkages that move independently and share a remote rotational center. In an embodiment, the remote rotational center may be positioned at a surface of the micro pick up array to prevent damage to the array of micro devices during transfer.
摘要翻译： 公开了用于将微器件或微阵列阵列转移到衬底或从衬底传送微阵列的系统和方法。 在一个实施例中，远程中心机器人允许微拾取阵列和目标基板之间的即时对准。 远程中心机器人可以包括独立移动并共享远程旋转中心的多个对称联动。 在一个实施例中，远程旋转中心可以定位在微拾取阵列的表面处，以防止在传送期间损坏微器件阵列。
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