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US08560060B2 Isolation of sensing and stimulation circuitry 有权
感测和刺激电路的隔离

Isolation of sensing and stimulation circuitry
摘要:
The disclosure describes techniques of reducing or eliminating a commonality between two modules within the same implantable medical device. Each module within the implantable medical device provides therapy to a patient. The commonality between the two modules exists due to at least one common component shared by the two modules. The commonality between the two modules may create common-mode interference and a shunt current. In accordance with this disclosure, various isolation circuits located at various locations are disclosed to reduce or eliminate the commonality between the two modules. The reduction or elimination of the commonality between the two modules may reduce or eliminate common-mode interference and the shunt current.
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