Isolation of sensing and stimulation circuitry
    8.
    发明授权
    Isolation of sensing and stimulation circuitry 有权
    感测和刺激电路的隔离

    公开(公告)号:US08560060B2

    公开(公告)日:2013-10-15

    申请号:US12551377

    申请日:2009-08-31

    IPC分类号: A61N1/16

    摘要: The disclosure describes techniques of reducing or eliminating a commonality between two modules within the same implantable medical device. Each module within the implantable medical device provides therapy to a patient. The commonality between the two modules exists due to at least one common component shared by the two modules. The commonality between the two modules may create common-mode interference and a shunt current. In accordance with this disclosure, various isolation circuits located at various locations are disclosed to reduce or eliminate the commonality between the two modules. The reduction or elimination of the commonality between the two modules may reduce or eliminate common-mode interference and the shunt current.

    摘要翻译: 本公开描述了减少或消除同一可植入医疗装置内的两个模块之间的共同性的技术。 可植入医疗装置内的每个模块向患者提供治疗。 由于两个模块共享的至少一个公共组件,存在两个模块之间的通用性。 两个模块之间的通用性可能会产生共模干扰和分流电流。 根据本公开,公开了位于各个位置处的各种隔离电路,以减少或消除两个模块之间的共同性。 减少或消除两个模块之间的通用性可以减少或消除共模干扰和分流电流。