发明授权
- 专利标题： Multilayer printed wiring board
- 专利标题（中）： 多层印刷线路板
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申请号： US13561247申请日： 2012-07-30
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公开(公告)号： US08563420B2公开(公告)日： 2013-10-22
- 发明人: Takashi Kariya , Akira Mochida
- 申请人： Takashi Kariya , Akira Mochida
- 申请人地址： JP Ogaki-shi
- 专利权人： Ibiden Co., Ltd.
- 当前专利权人： Ibiden Co., Ltd.
- 当前专利权人地址： JP Ogaki-shi
- 代理机构： Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权： JP2003-407501 20031205; JP2004-350731 20041203
- 主分类号： H01L21/4763
- IPC分类号： H01L21/4763
摘要：
A method for manufacturing a printed wiring board includes forming an uncalcined layer containing a raw ceramic material on a first metal layer, firing the uncalcined layer formed on the first metal layer such that a high dielectric constant layer having a ceramic body calcined in a sheet form is formed on the first metal layer, forming a second metal layer on the high dielectric constant layer on the opposite side of the high dielectric constant layer with respect to the first metal layer such that a layered capacitor having the high dielectric constant layer and first and second layer electrodes sandwiching the high dielectric constant layer is formed, and disposing the layered capacitor in a main body.
公开/授权文献
- US20120302010A1 MULTILAYER PRINTED WIRING BOARD 公开/授权日：2012-11-29
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