公开(公告)号：US08093508B2

公开(公告)日：2012-01-10

申请号：US12758908

申请日：2010-04-13

申请人： Takashi Kariya ,  Akira Mochida

发明人： Takashi Kariya ,  Akira Mochida

IPC分类号： H05K1/16 ,  H05K1/11

CPC分类号： H01L21/6835 ,  H01L21/4857 ,  H01L2221/68345 ,  H01L2221/68363 ,  H01L2224/05001 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/0102 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/3011 ,  H05K1/162 ,  H05K3/4602 ,  H05K2201/0175 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/09718 ,  H05K2203/0353 ,  Y10T29/435 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A printed wiring board including a first insulating layer, a second insulating layer formed over the first insulating layer, a capacitor portion including an upper electrode, a lower electrode and a ceramic high dielectric layer formed between the upper electrode and the lower electrode, the capacitor portion sandwiched by the first insulating layer and the second insulating layer, an upper electrode connecting portion passing through the capacitor portion without contact and through the second insulating layer and electrically connected to the upper electrode of the capacitor portion, and a lower electrode connecting portion passing through the second insulating layer and the upper electrode of the capacitor portion without contact and electrically connected to the lower electrode in contact.

摘要翻译： 一种印刷布线板，包括形成在第一绝缘层上的第一绝缘层，第二绝缘层，形成在上电极和下电极之间的上电极，下电极和陶瓷高介电层的电容器部分，电容器 夹在第一绝缘层和第二绝缘层之间的部分，通过电容器部分而没有接触并穿过第二绝缘层并电连接到电容器部分的上电极的上电极连接部分和通过电容器部分的下电极连接部分 通过第二绝缘层和电容器部分的上电极而不接触并与下电极接触地电连接。

公开(公告)号：US20090200069A1

公开(公告)日：2009-08-13

申请号：US12419007

申请日：2009-04-06

申请人： Takashi KARIYA ,  Akira Mochida

发明人： Takashi KARIYA ,  Akira Mochida

IPC分类号： H05K1/03 ,  H05K1/11 ,  H05K1/16 ,  H05K1/09

CPC分类号： H05K1/162 ,  H05K1/0231 ,  H05K1/0271 ,  H05K1/113 ,  H05K3/4602 ,  H05K2201/0133 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0187 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09718 ,  H05K2201/09763 ,  H05K2201/10522 ,  H05K2201/10734

摘要： A multilayer printed wiring board 10 includes: a mounting portion 60 on the top surface of which is mounted a semiconductor element that is electrically connected to a wiring pattern 32, etc.; and a capacitor portion 40 having a high dielectric constant layer 43, formed of ceramic and first and second layer electrodes 41 and 42 that sandwich the high dielectric constant layer 43. One of either of the first and second layer electrodes 41 and 42 is connected to a power supply line of the semiconductor element and the other of either of the first and second layer electrodes 41 and 42 is connected to a ground line. In this multilayer printed wiring board 10, high dielectric constant layer 43 included in the layered capacitor portion 40, which is connected between the power supply line and the ground line, is formed of ceramic. With this structure, the static capacitance of the layered capacitor portion 40 can be high, and an adequate decoupling effect is exhibited even under circumstances in which instantaneous potential drops occur readily.

摘要翻译： 多层印刷电路板10包括：安装部分60，其顶表面上安装有电连接到布线图案32的半导体元件; 以及具有由陶瓷形成的高介电常数层43的电容器部分40和夹在高介电常数层43上的第一和第二层电极41和42。第一和第二层电极41和42中的一个连接到 半导体元件的电源线和第一和第二层电极41和42中的另一个连接到接地线。 在这种多层印刷电路板10中，连接在电源线和接地线之间的层状电容器部分40中包括的高介电常数层43由陶瓷形成。 利用这种结构，层状电容器部分40的静态电容可以很高，并且即使在容易发生瞬时电位下降的情况下也可以发挥足够的去耦效应。

公开(公告)号：US20080104833A1

公开(公告)日：2008-05-08

申请号：US11964355

申请日：2007-12-26

申请人： Takashi KARIYA ,  Akira MOCHIDA

发明人： Takashi KARIYA ,  Akira MOCHIDA

IPC分类号： H05K3/30 ,  H01K3/10 ,  H05K3/10 ,  H05K1/00

CPC分类号： H01L21/6835 ,  H01L21/4857 ,  H01L2221/68345 ,  H01L2221/68363 ,  H01L2224/05001 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/0102 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/3011 ,  H05K1/162 ,  H05K3/4602 ,  H05K2201/0175 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/09718 ,  H05K2203/0353 ,  Y10T29/435 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49165

摘要： In a printed wiring board 10, an upper electrode connecting portion 52 penetrates through a capacitor portion 40 in top to bottom direction so that an upper electrode connecting portion first part 52a is not in contact with the capacitor portion 40, passes through an upper electrode connecting portion third part 52c provided at the upper portion of the capacitor portion 40, and then connects from the upper electrode connecting portion second part 52b to an upper electrode 42. Furthermore, a lower electrode connecting portion 51 penetrates through the capacitor portion 40 in top to bottom direction so that it is not in contact with the upper electrode 42 of the capacitor portion 40, but is in contact with a lower electrode 41. Therefore, the upper electrode connecting portion 52 and the lower electrode connecting portion 51 can be formed even after in process of build-up, the whole surface is covered by a high dielectric capacitor sheet that has a structure that a high dielectric layer is sandwiched between two metal foils and will afterwards serve as the capacitor portion 40.

摘要翻译： 在印刷布线板10中，上部电极连接部52从上下方向贯穿电容器部40，使上部电极连接部第一部分52a不与电容器部40接触，通过上部电极 连接部分第三部分52c设置在电容器部分40的上部，然后从上电极连接部分第二部分52b连接到上电极42。 此外，下电极连接部51从上下方向贯通电容器部40，使其不与电容器部40的上部电极42接触，而与下部电极41接触。 因此，上部电极连接部52和下部电极连接部51即使在积聚的过程中也可以形成，整个表面被高介电电容器片覆盖，该介电电容片具有将介电层夹在高介电层之间的结构 两个金属箔，然后用作电容器部分40。

公开(公告)号：US20070145540A1

公开(公告)日：2007-06-28

申请号：US11634862

申请日：2006-12-07

申请人： Akira Mochida

发明人： Akira Mochida

IPC分类号： H01L23/552

CPC分类号： H01L23/4334 ,  H01L23/3107 ,  H01L23/3735 ,  H01L23/49537 ,  H01L23/49575 ,  H01L24/32 ,  H01L24/33 ,  H01L24/36 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/40137 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device includes: first and second metal electrodes having inner surfaces facing each other; a semiconductor element sandwiched between the electrodes; and first and second insulation substrates disposed on the electrode and opposite to the semiconductor element, respectively. Each of the insulation substrates is made of ceramics. At least one of the electrodes includes a plurality of layers stacked in a direction parallel to a stacking direction. One layer disposed on a semiconductor element side has a thermal expansion coefficient, which is higher than that of another layer disposed on an insulation substrate side.

摘要翻译： 半导体器件包括：具有彼此面对的内表面的第一和第二金属电极; 夹在电极之间的半导体元件; 以及分别设置在电极上并与半导体元件相对的第一和第二绝缘基板。 每个绝缘基板由陶瓷制成。 电极中的至少一个包括在平行于堆叠方向的方向上堆叠的多个层。 设置在半导体元件侧的一层的热膨胀系数高于设置在绝缘基板侧的另一层的热膨胀系数。

公开(公告)号：US20070018197A1

公开(公告)日：2007-01-25

申请号：US11484701

申请日：2006-07-12

申请人： Akira Mochida ,  Kuniaki Mamitsu ,  Kenichi Oohama

发明人： Akira Mochida ,  Kuniaki Mamitsu ,  Kenichi Oohama

IPC分类号： H01L31/111

CPC分类号： H01L25/105 ,  H01L2224/32245 ,  H01L2225/1029 ,  H01L2225/1094 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/3511 ,  H01L2924/00

摘要： A semiconductor device is disclosed that includes a first and a second semiconductor package. Each semiconductor package includes a semiconductor element, a plurality of electrode members, and an encapsulating member. The semiconductor elements are interposed between the respective electrode members, and the electrode members are in electrical communication with and provide heat transfer for the respective semiconductor element. The encapsulating member encapsulates the respective semiconductor element between the respective electrode members, and an outer surface of each of the electrode members is exposed from the respective encapsulating member. Each semiconductor package includes a connecting terminal electrically coupled to one of the electrode members and extending outward so as to be exposed from the respective encapsulating member. The connecting terminals are electrically connected by abutment or via a conductive junction material.

摘要翻译： 公开了一种包括第一和第二半导体封装的半导体器件。 每个半导体封装包括半导体元件，多个电极构件和封装构件。 半导体元件插入在各个电极部件之间，并且电极部件与各个半导体元件电连通并提供热传递。 封装构件将相应的半导体元件封装在各个电极构件之间，并且每个电极构件的外表面从相应的封装构件露出。 每个半导体封装包括电耦合到电极构件之一并向外延伸以便从相应的封装构件露出的连接端子。 连接端子通过邻接或通过导电接合材料电连接。

公开(公告)号：US09312211B2

公开(公告)日：2016-04-12

申请号：US14383316

申请日：2013-02-28

申请人： Takuya Kadoguchi ,  Shingo Iwasaki ,  Akira Mochida ,  Tomomi Okumura

发明人： Takuya Kadoguchi ,  Shingo Iwasaki ,  Akira Mochida ,  Tomomi Okumura

IPC分类号： H01L23/495 ,  H01L23/31 ,  H01L23/498 ,  H01L23/051 ,  H01L25/18

CPC分类号： H01L23/49575 ,  H01L23/051 ,  H01L23/3107 ,  H01L23/49513 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49562 ,  H01L23/498 ,  H01L23/49833 ,  H01L23/49844 ,  H01L23/49861 ,  H01L24/73 ,  H01L25/18 ,  H01L2224/29111 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/01047 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01033

摘要： The present invention relates to a semiconductor device and a manufacturing method thereof. The semiconductor device has a plurality of power units placed in parallel in a predetermined direction, wherein each of the power units includes a plurality of semiconductor elements placed on a metal plate having predetermined gaps with each other. The semiconductor elements of each of the two power units include a near-sided semiconductor element that is closer to an inlet of the resin among the two semiconductor elements having the predetermined gap therebetween. A structure is positioned on a passage and downstream in a resin flow direction relative to a predetermined position that corresponds to end parts of the near-sided semiconductor elements. The structure is a joint to connect the two power units placed adjacent to each other in the predetermined direction, and to be integrally sealed with the resin, along with the power unit.

摘要翻译： 半导体器件及其制造方法技术领域本发明涉及半导体器件及其制造方法。 半导体器件具有沿预定方向平行放置的多个功率单元，其中每个功率单元包括放置在具有彼此具有预定间隙的金属板上的多个半导体元件。 两个功率单元中的每一个的半导体元件包括在其间具有预定间隙的两个半导体元件中更靠近树脂入口的近侧半导体元件。 结构体相对于对应于近侧半导体元件的端部的预定位置在树脂流动方向上位于通道和下游。 该结构是将预定方向上彼此相邻放置的两个动力单元连接并与动力单元一体地与树脂密封的连接部。

公开(公告)号：US20120302010A1

公开(公告)日：2012-11-29

申请号：US13561247

申请日：2012-07-30

申请人： Takashi KARIYA ,  Akira Mochida

发明人： Takashi KARIYA ,  Akira Mochida

IPC分类号： H01L21/58

CPC分类号： H05K1/162 ,  H05K1/0231 ,  H05K1/0271 ,  H05K1/113 ,  H05K3/4602 ,  H05K2201/0133 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0187 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09718 ,  H05K2201/09763 ,  H05K2201/10522 ,  H05K2201/10734

摘要： A method for manufacturing a printed wiring board includes forming an uncalcined layer containing a raw ceramic material on a first metal layer, firing the uncalcined layer formed on the first metal layer such that a high dielectric constant layer having a ceramic body calcined in a sheet form is formed on the first metal layer, forming a second metal layer on the high dielectric constant layer on the opposite side of the high dielectric constant layer with respect to the first metal layer such that a layered capacitor having the high dielectric constant layer and first and second layer electrodes sandwiching the high dielectric constant layer is formed, and disposing the layered capacitor in a main body.

摘要翻译： 一种制造印刷电路板的方法包括在第一金属层上形成含有原料陶瓷材料的未煅烧层，焙烧形成在第一金属层上的未煅烧层，使得具有以片状形式煅烧的陶瓷体的高介电常数层 形成在第一金属层上，相对于第一金属层在高介电常数层的相对侧的高介电常数层上形成第二金属层，使得具有高介电常数层的层状电容器和第一金属层 形成夹着高介电常数层的第二层电极，并将层叠电容器配置在主体中。

公开(公告)号：US07856710B2

公开(公告)日：2010-12-28

申请号：US11964355

申请日：2007-12-26

申请人： Takashi Kariya ,  Akira Mochida

发明人： Takashi Kariya ,  Akira Mochida

IPC分类号： H01K3/10

CPC分类号： H01L21/6835 ,  H01L21/4857 ,  H01L2221/68345 ,  H01L2221/68363 ,  H01L2224/05001 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/0102 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/3011 ,  H05K1/162 ,  H05K3/4602 ,  H05K2201/0175 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/09718 ,  H05K2203/0353 ,  Y10T29/435 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A method of manufacturing a printed wiring board including preparing a high-dielectric capacitor sheet including a ceramic high-dielectric layer sandwiched by upper and lower electrode sheets, attaching the high-dielectric capacitor sheet to a first insulating layer, forming through holes for the upper and lower electrode sheets such that the through holes penetrate through the ceramic high-dielectric layer and upper and lower electrode sheets, forming a second insulating layer which fills the through holes and covers an upper surface of the high-dielectric capacitor sheet, forming an upper electrode connecting first hole, an upper electrode connecting second hole and a lower electrode connecting hole, filling the upper holes with conductive material such that the upper electrode connecting first hole and the upper electrode connecting second hole are connected to form an upper electrode connection portion, and filling the lower electrode connecting hole with conductive material to form a lower electrode connecting portion.

摘要翻译： 一种印刷电路板的制造方法，其特征在于，包括：制作包含由上下电极片夹着的陶瓷高电介质层的高介电电容器片，将所述高介电电容片贴附在第一绝缘层上， 和下电极片，使得通孔穿过陶瓷高介电层和上下电极片，形成填充通孔并覆盖高介电电容器片的上表面的第二绝缘层，形成上电极片 电极连接第一孔，上电极连接第二孔和下电极连接孔，用导电材料填充上孔，使得连接第一孔和连接第二孔的上电极的上电极连接形成上电极连接部， 并用导电材料填充下电极连接孔 m为下部电极连接部。

公开(公告)号：US5826263A

公开(公告)日：1998-10-20

申请号：US738694

申请日：1996-10-28

申请人： Kaoru Nakabayashi ,  Akira Mochida

发明人： Kaoru Nakabayashi ,  Akira Mochida

IPC分类号： G06F17/30

CPC分类号： G06F17/30398 ,  G06F17/30572 ,  Y10S707/99932 ,  Y10S707/99937 ,  Y10S707/99945

摘要： The present invention provides a data management system realizing simple, clear, and easily understandable display and operation. The data management system is applicable, for example, to management of name cards. In management of name cards, name card data (101) includes a plurality of name card records (100). A card summary record (110, 112) prepared as title data includes a card ID and part of item data included in each name card record (100). Each summarized card data (111, 113) includes a plurality of card summary records (110, 112) collected according to a predetermined condition, and is placed into a certain card box (120, 121). Each card box has a characteristic name such as `business` or `private`. Visually hierarchical display of data in the form of a card box list, a target list including a plurality of target data, and individual name card data helps the user clearly understand the whole data display and data retrieval. This allows quick access to a desired name card. The target list is data having a fixed length and used on a memory, thereby realizing high-speed data retrieval and display. The system of the invention further includes a data maintenance mechanism and an auto-dialing mechanism.

摘要翻译： 本发明提供一种数据管理系统，实现简单，清晰，易于理解的显示和操作。 数据管理系统适用于例如名片管理。 在名片管理中，名片数据（101）包括多张名片记录（100）。 作为标题数据准备的卡简要记录（110,112）包括卡ID和包括在每个名片记录（100）中的项目数据的一部分。 每个汇总卡数据（111,113）包括根据预定条件收集的多个卡概要记录（110,112），并被放置在某个卡盒（120,121）中。 每个卡盒都有一个特征名称，如“商业”或“私人”。 以卡盒列表的形式，包括多个目标数据的目标列表和个人名片数据的形式的视觉分层显示有助于用户清楚地了解整个数据显示和数据检索。 这样可以快速访问所需的名片。 目标列表是具有固定长度并用于存储器的数据，从而实现高速数据检索和显示。 本发明的系统还包括数据维护机制和自动拨号机制。

公开(公告)号：US08253030B2

公开(公告)日：2012-08-28

申请号：US12948894

申请日：2010-11-18

申请人： Takashi Kariya ,  Akira Mochida

发明人： Takashi Kariya ,  Akira Mochida

IPC分类号： H05K1/11

CPC分类号： H05K1/162 ,  H05K1/0231 ,  H05K1/0271 ,  H05K1/113 ,  H05K3/4602 ,  H05K2201/0133 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0187 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09718 ,  H05K2201/09763 ,  H05K2201/10522 ,  H05K2201/10734

摘要： A printed wiring board includes a main body having a mounting portion and ground and power supply pads in the mounting portion such that a ground line of a semiconductor device is connected to a ground pad and a power supply line of the device is connected to a power supply pad, and a layered capacitor disposed in the main body and having a high dielectric constant layer and first and second layer electrodes sandwiching the dielectric layer. One of the electrodes is connected to the power supply line and the other electrode is connected to the ground line, the first electrode has a solid pattern including passage holes through which second rod terminals connected to the second electrode pass in a non-contacting manner, and the second electrode has a solid pattern including passage holes through which first rod terminals connected to the first electrode pass in a non-contacting manner.

摘要翻译： 一种印刷电路板，包括具有安装部分的主体和安装部分中的接地和电源焊盘，使得半导体器件的接地线连接到接地焊盘，并且该设备的电源线连接到电源 供电焊盘和设置在主体中并具有高介电常数层的层状电容器和夹着介电层的第一和第二层电极。 电极中的一个连接到电源线，另一个电极连接到接地线，第一电极具有固体图案，其包括通孔，第二电极与第二电极连接，第二电极以非接触的方式通过， 并且第二电极具有固体图案，其包括通孔，通过该通孔与第一电极连接的第一杆端子以非接触方式通过。