Invention Grant
- Patent Title: Light-emitting device package
- Patent Title (中): 发光装置封装
-
Application No.: US13347163Application Date: 2012-01-10
-
Publication No.: US08564005B2Publication Date: 2013-10-22
- Inventor: Jong-kil Park , Jae-sung You , Sung-uk Zhang , Tae-gyu Kim , Bang-weon Lee
- Applicant: Jong-kil Park , Jae-sung You , Sung-uk Zhang , Tae-gyu Kim , Bang-weon Lee
- Applicant Address: KR Suwon-Si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-Si
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2011-0003556 20110113
- Main IPC: H01L33/50
- IPC: H01L33/50
Abstract:
A light-emitting device package including: a package main body including a cavity and a lead frame including a mounting portion disposed in the cavity and a plurality of terminal portions; a light-emitting device chip mounted on the mounting portion; a plurality of bonding wires for electrically connecting the plurality of terminal portions and the light-emitting device chip; a light-transmitting encapsulation layer filled in the cavity; and a light-transmitting cap member disposed in the cavity and blocking the encapsulation layer to contact the plurality of bonding wires.
Public/Granted literature
- US20120181559A1 LIGHT-EMITTING DEVICE PACKAGE Public/Granted day:2012-07-19
Information query
IPC分类:
