公开(公告)号：US08564005B2

公开(公告)日：2013-10-22

申请号：US13347163

申请日：2012-01-10

申请人： Jong-kil Park ,  Jae-sung You ,  Sung-uk Zhang ,  Tae-gyu Kim ,  Bang-weon Lee

发明人： Jong-kil Park ,  Jae-sung You ,  Sung-uk Zhang ,  Tae-gyu Kim ,  Bang-weon Lee

IPC分类号： H01L33/50

CPC分类号： H01L33/58 ,  H01L33/507 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A light-emitting device package including: a package main body including a cavity and a lead frame including a mounting portion disposed in the cavity and a plurality of terminal portions; a light-emitting device chip mounted on the mounting portion; a plurality of bonding wires for electrically connecting the plurality of terminal portions and the light-emitting device chip; a light-transmitting encapsulation layer filled in the cavity; and a light-transmitting cap member disposed in the cavity and blocking the encapsulation layer to contact the plurality of bonding wires.

摘要翻译： 一种发光器件封装，包括：包括空腔的封装主体和包括设置在所述空腔中的安装部分和多个端子部分的引线框架; 安装在所述安装部上的发光装置芯片; 多个用于电连接所述多个端子部分和所述发光器件芯片的接合线; 填充在空腔中的透光封装层; 以及设置在所述空腔中并阻挡所述封装层以接触所述多个接合线的透光盖构件。

公开(公告)号：US20120181559A1

公开(公告)日：2012-07-19

申请号：US13347163

申请日：2012-01-10

申请人： Jong-kil Park ,  Jae-sung You ,  Sung-uk Zhang ,  Tae-gyu Kim ,  Bang-weon Lee

发明人： Jong-kil Park ,  Jae-sung You ,  Sung-uk Zhang ,  Tae-gyu Kim ,  Bang-weon Lee

IPC分类号： H01L33/50 ,  H01L33/58

CPC分类号： H01L33/58 ,  H01L33/507 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A light-emitting device package including: a package main body including a cavity and a lead frame including a mounting portion disposed in the cavity and a plurality of terminal portions; a light-emitting device chip mounted on the mounting portion; a plurality of bonding wires for electrically connecting the plurality of terminal portions and the light-emitting device chip; a light-transmitting encapsulation layer filled in the cavity; and a light-transmitting cap member disposed in the cavity and blocking the encapsulation layer to contact the plurality of bonding wires.

摘要翻译： 一种发光器件封装，包括：包括空腔的封装主体和包括设置在所述空腔中的安装部分和多个端子部分的引线框架; 安装在所述安装部上的发光装置芯片; 多个用于电连接所述多个端子部分和所述发光器件芯片的接合线; 填充在空腔中的透光封装层; 以及设置在所述空腔中并阻挡所述封装层以接触所述多个接合线的透光盖构件。

公开(公告)号：US20130032842A1

公开(公告)日：2013-02-07

申请号：US13563227

申请日：2012-07-31

申请人： Jong Kil PARK ,  Sung Uk Zhang ,  Jong Sup Song

发明人： Jong Kil PARK ,  Sung Uk Zhang ,  Jong Sup Song

IPC分类号： H01L33/60 ,  H01L33/48

CPC分类号： H01L33/486 ,  H01L24/97 ,  H01L25/075 ,  H01L33/505 ,  H01L33/60 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/00

摘要： There are provided a light emitting device package and a method of manufacturing the same. The light emitting device package includes a body part including a through hole formed in a thickness direction; at least one light emitting device disposed within the through hole; and a wavelength conversion part filling the through hole and supporting the light emitting device.

摘要翻译： 提供了一种发光器件封装及其制造方法。 发光器件封装包括：主体部，包括沿厚度方向形成的通孔; 设置在通孔内的至少一个发光器件; 以及波长转换部分，其填充所述通孔并支撑所述发光器件。