发明授权
- 专利标题: Semiconductor devices and methods of forming the same
- 专利标题(中): 半导体器件及其形成方法
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申请号: US13243073申请日: 2011-09-23
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公开(公告)号: US08569821B2公开(公告)日: 2013-10-29
- 发明人: Sangjin Hyun , Yugyun Shin , Hagju Cho , Hyung-seok Hong
- 申请人: Sangjin Hyun , Yugyun Shin , Hagju Cho , Hyung-seok Hong
- 申请人地址: KR
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR
- 代理机构: Myers Bigel Sibley & Sajovec, P.A.
- 优先权: KR10-2008-0102538 20081020
- 主分类号: H01L27/108
- IPC分类号: H01L27/108 ; H01L29/76 ; H01L29/94 ; H01L31/119
摘要:
Provided are a semiconductor device and a method of forming the same. The method may include forming a gate dielectric layer including a plurality of elements on a substrate; supplying a specific element to the gate dielectric layer; forming a product though reacting the specific element with at least one of the plurality of elements; and removing the product.
公开/授权文献
- US20120012942A1 SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME 公开/授权日:2012-01-19
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