发明授权
- 专利标题： Semiconductor device arrangement with a first semiconductor device and with a plurality of second semiconductor devices
- 专利标题（中）： 具有第一半导体器件和多个第二半导体器件的半导体器件布置
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申请号： US13275151申请日： 2011-10-17
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公开(公告)号： US08569842B2公开(公告)日： 2013-10-29
- 发明人: Rolf Weis , Franz Hirler , Matthias Stecher , Armin Willmeroth , Gerald Deboy , Martin Feldtkeller
- 申请人： Rolf Weis , Franz Hirler , Matthias Stecher , Armin Willmeroth , Gerald Deboy , Martin Feldtkeller
- 申请人地址： AT Villach
- 专利权人： Infineon Technologies Austria AG
- 当前专利权人： Infineon Technologies Austria AG
- 当前专利权人地址： AT Villach
- 代理机构： Slater & Matsil, L.L.P.
- 主分类号： H01L27/06
- IPC分类号： H01L27/06 ; H01L27/088 ; H01L27/098 ; H01L29/161 ; H01L29/20 ; H01L29/778 ; H01L29/788
摘要：
A semiconductor device arrangement includes a first semiconductor device having a load path, and a number of second transistors, each having a load path between a first and a second load terminal and a control terminal. The second transistors have their load paths connected in series and connected in series to the load path of the first transistor. Each of the second transistors has its control terminal connected to the load terminal of one of the other second transistors. One of the second transistors has its control terminal connected to one of the load terminals of the first semiconductor device.
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