Invention Grant
US08580656B2 Process for inhibiting corrosion and removing contaminant from a surface during wafer dicing and composition useful therefor 有权
用于在晶片切割期间抑制腐蚀并从表面除去污染物的方法及其有用的组合物

Process for inhibiting corrosion and removing contaminant from a surface during wafer dicing and composition useful therefor
Abstract:
Adherence of contaminant residues or particles is suppressed, corrosion of exposed surfaces is substantially reduced or eliminated during the process of dicing a wafer by sawing. A fluoride-free aqueous composition comprising a dicarboxylic acid and/or salt thereof; a hydroxycarboxylic acid and/or salt thereof or amine group containing acid, a surfactant and deionized water is employed.
Information query
Patent Agency Ranking
0/0