Invention Grant
US08580656B2 Process for inhibiting corrosion and removing contaminant from a surface during wafer dicing and composition useful therefor
有权
用于在晶片切割期间抑制腐蚀并从表面除去污染物的方法及其有用的组合物
- Patent Title: Process for inhibiting corrosion and removing contaminant from a surface during wafer dicing and composition useful therefor
- Patent Title (中): 用于在晶片切割期间抑制腐蚀并从表面除去污染物的方法及其有用的组合物
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Application No.: US12499556Application Date: 2009-07-08
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Publication No.: US08580656B2Publication Date: 2013-11-12
- Inventor: Terence Quintin Collier , Charles A. Lhota , David Barry Rennie , Rajkumar Ramamurthi , Madhukar Bhaskara Rao , Dnyanesh Chandrakant Tamboli
- Applicant: Terence Quintin Collier , Charles A. Lhota , David Barry Rennie , Rajkumar Ramamurthi , Madhukar Bhaskara Rao , Dnyanesh Chandrakant Tamboli
- Applicant Address: US PA Allentown
- Assignee: Air Products and Chemicals, Inc.
- Current Assignee: Air Products and Chemicals, Inc.
- Current Assignee Address: US PA Allentown
- Agent Lina Yang
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/44 ; C03C15/00 ; C03C25/68 ; C09K13/00
Abstract:
Adherence of contaminant residues or particles is suppressed, corrosion of exposed surfaces is substantially reduced or eliminated during the process of dicing a wafer by sawing. A fluoride-free aqueous composition comprising a dicarboxylic acid and/or salt thereof; a hydroxycarboxylic acid and/or salt thereof or amine group containing acid, a surfactant and deionized water is employed.
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