发明授权
- 专利标题: Silicon nitride sintered body, method of producing the same, and silicon nitride circuit substrate and semiconductor module using the same
- 专利标题(中): 氮化硅烧结体及其制造方法,氮化硅电路基板及使用其的半导体模块
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申请号: US12737316申请日: 2009-07-03
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公开(公告)号: US08586493B2公开(公告)日: 2013-11-19
- 发明人: Youichirou Kaga , Junichi Watanabe
- 申请人: Youichirou Kaga , Junichi Watanabe
- 申请人地址: JP Tokyo
- 专利权人: Hitachi Metals, Ltd.
- 当前专利权人: Hitachi Metals, Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Edwards Neils PLLC
- 代理商 Paul F. Neils
- 优先权: JP2008-174314 20080703
- 国际申请: PCT/JP2009/062221 WO 20090703
- 国际公布: WO2010/002001 WO 20100107
- 主分类号: C04B35/584
- IPC分类号: C04B35/584 ; H01L23/15
摘要:
A silicon nitride sintered body, wherein in a silicon nitride substrate consisting of crystal grains of β-type silicon nitride and a grain boundary phase containing at least one type of rare earth element (RE), magnesium (Mg) and silicon (Si), the grain boundary phase consists of an amorphous phase and a MgSiN2 crystal phase. The X-ray diffraction peak intensity of any crystal plane of a crystal phase containing the rare earth element (RE) is less than 0.0005 times the sum of the diffraction peak intensities of (110), (200), (101), (210), (201), (310), (320) and (002) of the crystal grains of the β-type silicon nitride; and the X-ray diffraction peak intensity of (121) of the MgSiN2 crystal phase is 0.0005 to 0.003 times the sum of the X-ray diffraction peak intensities of (110), (200), (101), (210), (201), (310), (320) and (002) of the crystal grains of the β-type silicon nitride.
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