发明授权
- 专利标题： Wide band and radio frequency waveguide and hybrid integration in a silicon package
- 专利标题（中）： 宽带和射频波导以及混合集成在硅封装中
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申请号： US11761108申请日： 2007-06-11
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公开(公告)号： US08587106B2公开(公告)日： 2013-11-19
- 发明人: Carl O. Bozler , Jeremy Muldavin , Peter W. Wyatt , Craig L. Keast , Steven Rabe
- 申请人： Carl O. Bozler , Jeremy Muldavin , Peter W. Wyatt , Craig L. Keast , Steven Rabe
- 申请人地址： US MA Cambridge
- 专利权人： Massachusetts Institute of Technology
- 当前专利权人： Massachusetts Institute of Technology
- 当前专利权人地址： US MA Cambridge
- 代理机构： Gesmer Updegrove LLP
- 主分类号： H01L23/02
- IPC分类号： H01L23/02
摘要：
A device includes a device wafer having a circuit component formed thereon and having vias formed therein and a cap wafer bonded to the device wafer. The cap wafer has a cavity therein. The cavity has a post formed therein, and the post is positioned to mechanically support the vias formed in the device wafer. The cavity has a volume, the volume substantially enclosing the circuit component formed on the device wafer. The cavity has a width and height such that an impedance of a transmission line is dependent upon the width and height of the cavity, or the impedance of a transmission line is dependent upon the width of a center conductor within the cavity.
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