发明授权
- 专利标题: Microneedle electrode
- 专利标题(中): 微针电极
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申请号: US12790619申请日: 2010-05-28
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公开(公告)号: US08588884B2公开(公告)日: 2013-11-19
- 发明人: Anant V. Hegde , Amit Rajguru , Daniel Rogers Burnett , Christopher Hermanson
- 申请人: Anant V. Hegde , Amit Rajguru , Daniel Rogers Burnett , Christopher Hermanson
- 申请人地址: US CA San Francisco
- 专利权人: EMKinetics, Inc.
- 当前专利权人: EMKinetics, Inc.
- 当前专利权人地址: US CA San Francisco
- 代理机构: Levine Bagade Han LLP
- 主分类号: A61B5/0408
- IPC分类号: A61B5/0408 ; A61B5/0416 ; A61B5/0478 ; A61B5/0492 ; A61N1/04
摘要:
In certain variations, methods, systems and/or devices for enhancing conductivity of an electrical signal through a subject's skin using one or more microneedle electrodes are provided. A microneedle electrode may be applied to the subject's skin by placing the microneedle electrode in direct contact with the subject's skin. The microneedles of the microneedle electrode may be inserted into the skin such that the microneedles pierce stratum corneum of the skin up to or through dermis of the skin. An electrical signal passes or is conducted through or across the microneedle electrode and the subject's skin, where impedance of the microneedle electrode is minimal and greatly reduced compared to existing technologies.
公开/授权文献
- US20110295100A1 MICRONEEDLE ELECTRODE 公开/授权日:2011-12-01
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