Invention Grant
- Patent Title: Method of manufacturing printed circuit board
- Patent Title (中): 制造印刷电路板的方法
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Application No.: US13403380Application Date: 2012-02-23
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Publication No.: US08592135B2Publication Date: 2013-11-26
- Inventor: Jee Soo Mok , Je Gwang Yoo , Eung Suek Lee , Chang Sup Ryu
- Applicant: Jee Soo Mok , Je Gwang Yoo , Eung Suek Lee , Chang Sup Ryu
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon
- Priority: KR10-2008-0053667 20080609
- Main IPC: G03F7/26
- IPC: G03F7/26
Abstract:
A method of manufacturing a printed circuit board, including: applying a conductive paste including carbon nanotubes and a photosensitive binder on a bump-forming area of a circuit substrate having a circuit layer for transferring electrical signals; and patterning the conductive paste, thus forming bumps.
Public/Granted literature
- US20120148960A1 METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD Public/Granted day:2012-06-14
Information query
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