公开(公告)号：US08592135B2

公开(公告)日：2013-11-26

申请号：US13403380

申请日：2012-02-23

申请人： Jee Soo Mok ,  Je Gwang Yoo ,  Eung Suek Lee ,  Chang Sup Ryu

发明人： Jee Soo Mok ,  Je Gwang Yoo ,  Eung Suek Lee ,  Chang Sup Ryu

IPC分类号： G03F7/26

CPC分类号： H05K3/4007 ,  B82Y10/00 ,  H05K1/095 ,  H05K2201/026 ,  H05K2201/0367 ,  H05K2203/0514

摘要： A method of manufacturing a printed circuit board, including: applying a conductive paste including carbon nanotubes and a photosensitive binder on a bump-forming area of a circuit substrate having a circuit layer for transferring electrical signals; and patterning the conductive paste, thus forming bumps.

摘要翻译： 一种制造印刷电路板的方法，包括：在具有用于传送电信号的电路层的电路基板的凸起形成区域上涂覆包括碳纳米管和感光性粘合剂的导电浆料; 并图案化导电膏，从而形成凸块。

公开(公告)号：US20120148960A1

公开(公告)日：2012-06-14

申请号：US13403380

申请日：2012-02-23

申请人： Jee Soo Mok ,  Je Gwang Yoo ,  Eung Suek Lee ,  Chang Sup Ryu

发明人： Jee Soo Mok ,  Je Gwang Yoo ,  Eung Suek Lee ,  Chang Sup Ryu

IPC分类号： G03F7/20 ,  B82Y30/00 ,  B82Y40/00

CPC分类号： H05K3/4007 ,  B82Y10/00 ,  H05K1/095 ,  H05K2201/026 ,  H05K2201/0367 ,  H05K2203/0514

摘要： A method of manufacturing a printed circuit board, including: applying a conductive paste including carbon nanotubes and a photosensitive binder on a bump-forming area of a circuit substrate having a circuit layer for transferring electrical signals; and patterning the conductive paste, thus forming bumps.

摘要翻译： 一种制造印刷电路板的方法，包括：在具有用于传送电信号的电路层的电路基板的凸起形成区域上涂覆包括碳纳米管和感光性粘合剂的导电浆料; 并图案化导电膏，从而形成凸块。

公开(公告)号：US20090308650A1

公开(公告)日：2009-12-17

申请号：US12222176

申请日：2008-08-04

申请人： Eung Suek Lee ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Jun Oh Hwang ,  Jun Heyoung Park ,  Jee Soo Mok

发明人： Eung Suek Lee ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Jun Oh Hwang ,  Jun Heyoung Park ,  Jee Soo Mok

IPC分类号： H05K3/06 ,  H05K1/09

CPC分类号： H05K3/4069 ,  B82Y10/00 ,  H05K3/1291 ,  H05K3/4647 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/0355 ,  H05K2201/09827 ,  H05K2203/1126 ,  Y10T29/49155

摘要： The printed circuit board is manufactured using a simple process of forming a bump on a first metal layer using fireable paste containing carbon nanotubes, firing the first metal layer including the bump, forming an insulating layer and a second metal layer on the first metal layer, and patterning the first and second metal layers, thus specific resistance of the resulting printed circuit board is decreased, and electrical conductivity and cooling performance are improved.

摘要翻译： 使用在含有碳纳米管的可燃性糊料在第一金属层上形成凸块的方法，在第一金属层上焙烧包括凸块的第一金属层，形成绝缘层和第二金属层，制造印刷电路板， 并且对第一和第二金属层进行图案化，由此降低了印刷电路板的电阻率，提高了导电性和冷却性能。

公开(公告)号：US20100230146A1

公开(公告)日：2010-09-16

申请号：US12544959

申请日：2009-08-20

申请人： Eung Suek LEE ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Jun Oh Hwang ,  Jee Soo Mok

发明人： Eung Suek LEE ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Jun Oh Hwang ,  Jee Soo Mok

IPC分类号： H05K1/09 ,  C25D5/02

CPC分类号： H05K3/108 ,  B82Y10/00 ,  C23C18/38 ,  C25D5/022 ,  C25D5/10 ,  C25D9/08 ,  H05K3/249 ,  H05K2201/026 ,  H05K2201/0347 ,  H05K2203/135

摘要： Disclosed herein is a circuit layer including CNTs including an electroless copper plating layer formed on an insulating layer, and a CNT layer deposited on the electroless copper plating layer, thus the circuit layer has excellent electrical properties.

摘要翻译： 本发明公开了一种电路层，其包括在绝缘层上形成的化学镀铜层的CNT和沉积在化学镀铜层上的CNT层，因此电路层具有优异的电性能。

公开(公告)号：US08377748B2

公开(公告)日：2013-02-19

申请号：US13137669

申请日：2011-09-01

申请人： Eung Suek Lee ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Jun Oh Hwang ,  Jun Heyoung Park ,  Jee Soo Mok

发明人： Eung Suek Lee ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Jun Oh Hwang ,  Jun Heyoung Park ,  Jee Soo Mok

IPC分类号： H01L23/467

CPC分类号： H01L23/373 ,  B82Y30/00 ,  C04B35/80 ,  C04B2235/3217 ,  C04B2235/3418 ,  C04B2235/407 ,  C04B2235/408 ,  C04B2235/5288 ,  F28F3/02 ,  F28F21/02 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/3025 ,  Y10T29/49002 ,  Y10T29/4935 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacturing a cooling fin and package substrate that includes preparing a mold, which has a support base and a resin layer formed on the support base and including on a side thereof a groove, which is configured to form a cooling fin; printing fireable paste containing a carbon component on a side of the mold that has the groove configured to form a cooling fin; removing the support base to leave a cooling object; and firing the cooling object.

摘要翻译： 一种冷却翅片和封装基板的制造方法，其特征在于，包括：准备模具，所述模具具有支撑基体和树脂层，所述支撑基部和树脂层形成在所述支撑基部上，并且在其一侧包括凹槽，所述凹槽被构造成形成冷却翅片; 在所述模具的侧面上印刷含有碳成分的可燃性糊料，所述成型体具有形成冷却翅片的所述凹槽; 移除支撑底座以留下冷却物体; 并发射冷却对象。

公开(公告)号：US20090301767A1

公开(公告)日：2009-12-10

申请号：US12222177

申请日：2008-08-04

申请人： Jee Soo Mok ,  Je Gwang Yoo ,  Eung Suek Lee ,  Chang Sup Ryu

发明人： Jee Soo Mok ,  Je Gwang Yoo ,  Eung Suek Lee ,  Chang Sup Ryu

IPC分类号： H05K3/10 ,  H05K1/00

CPC分类号： H05K3/4007 ,  B82Y10/00 ,  H05K1/095 ,  H05K2201/026 ,  H05K2201/0367 ,  H05K2203/0514

摘要： Disclosed is a printed circuit board including bumps formed using a conductive paste including carbon nanotubes and a photosensitive binder. A method of manufacturing the printed circuit board is also provided. The printed circuit board includes bumps formed using the conductive paste having carbon nanotubes, and can realize good electrical connection with electronic parts mounted thereon. The bumps can be formed at a fine pitch, thus realizing a circuit layer having a high density.

摘要翻译： 公开了一种印刷电路板，其包括使用包括碳纳米管和感光性粘合剂的导电浆料形成的凸块。 还提供了制造印刷电路板的方法。 印刷电路板包括使用具有碳纳米管的导电膏形成的凸块，并且可以实现与安装在其上的电子部件的良好的电连接。 可以以细间距形成凸块，从而实现高密度的电路层。

公开(公告)号：US20090294956A1

公开(公告)日：2009-12-03

申请号：US12219442

申请日：2008-07-22

申请人： Eung Suek Lee ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Jun Oh Hwang ,  Jun Heyoung Park ,  Jee Soo Mok

发明人： Eung Suek Lee ,  Je Gwang Yoo ,  Chang Sup Ryu ,  Jun Oh Hwang ,  Jun Heyoung Park ,  Jee Soo Mok

IPC分类号： H01L23/467 ,  F28F7/00 ,  H01L21/58 ,  B21D53/02

CPC分类号： H01L23/373 ,  B82Y30/00 ,  C04B35/80 ,  C04B2235/3217 ,  C04B2235/3418 ,  C04B2235/407 ,  C04B2235/408 ,  C04B2235/5288 ,  F28F3/02 ,  F28F21/02 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/3025 ,  Y10T29/49002 ,  Y10T29/4935 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed herein is a cooling fin, which is excellent in cooling performance and is simply manufactured, a package substrate comprising the cooling fin, and a manufacturing method thereof. Fireable paste containing a carbon component is applied into grooves of a mold, thus forming a cooling fin having a pattern corresponding to the grooves. Thus, it enables the production of cooling fins having various configurations, thus improving a cooling performance of a package substrate incorporating the cooling fin.

摘要翻译： 本发明公开了一种冷却翅片，其冷却性能优良，制造简单，包括冷却翅片的封装基板及其制造方法。 含有碳成分的可燃糊剂被施加到模具的凹槽中，从而形成具有对应于凹槽的图案的冷却翅片。 因此，能够制造具有各种构造的散热片，从而提高包含冷却片的封装基板的冷却性能。

公开(公告)号：US20090236131A1

公开(公告)日：2009-09-24

申请号：US12222055

申请日：2008-07-31

申请人： Jee Soo Mok ,  Je Gwang Yoo ,  Chang Sup Ryu

发明人： Jee Soo Mok ,  Je Gwang Yoo ,  Chang Sup Ryu

IPC分类号： H05K1/09 ,  H05K3/02

CPC分类号： H05K3/1258 ,  H01L2224/11 ,  H05K3/4069 ,  H05K3/4602 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09545 ,  H05K2201/096 ,  H05K2203/0568 ,  H05K2203/1152 ,  Y10T29/49156

摘要： Disclosed herein is a multilayered circuit board, including: a multilayered printed circuit board manufactured using the method includes an insulating resin layer having via holes, on one side of which a first circuit layer including circuit patterns is formed, and on the other side of which a second circuit layer, including connecting pads, is formed, the pads protruding over the via holes; a build-up layer formed on the first circuit layer, the build-up layer including a plurality of insulating layers and a plurality of circuit layers; and a solder resist layer formed on an outermost layer of the build-up layer.

摘要翻译： 本文公开了一种多层电路板，包括：使用该方法制造的多层印刷电路板，包括具有通孔的绝缘树脂层，其一侧形成有包括电路图案的第一电路层，另一侧 形成包括连接焊盘的第二电路层，焊盘在通孔上方突出; 形成在所述第一电路层上的积聚层，所述堆积层包括多个绝缘层和多个电路层; 以及形成在积层层的最外层上的阻焊层。

公开(公告)号：US08198550B2

公开(公告)日：2012-06-12

申请号：US12385003

申请日：2009-03-27

申请人： Jee Soo Mok ,  Je Gwang Yoo ,  Chang Sup Ryu

发明人： Jee Soo Mok ,  Je Gwang Yoo ,  Chang Sup Ryu

IPC分类号： H01R12/04

CPC分类号： H05K3/4069 ,  H05K3/06 ,  H05K3/107 ,  H05K3/28 ,  H05K3/4647 ,  H05K2201/0355 ,  H05K2201/0376 ,  H05K2201/09481 ,  H05K2203/0278 ,  H05K2203/1461 ,  Y10T29/49144 ,  Y10T29/49155

摘要： A printed circuit board and a method of manufacturing the printed circuit board, in which the printed circuit board includes an insulating layer, a circuit layer embedded in the insulating layer and having a connection pad that is embedded in the insulating layer such that one side of the connection pad is flush with a surface of the insulating layer, and insulating materials configured to protect the circuit layer from an external environment and having an opening through which the connection pad is exposed. The manufacturing process includes a step of pressing the circuit layer and the insulating material into the insulating layer to form a level surface while leaving the connection pads flush at the surface. The method makes the printed circuit board slim, and increases reliability and the degree of design freedom.

摘要翻译： 一种印刷电路板和印刷电路板的制造方法，其中印刷电路板包括绝缘层，嵌入绝缘层中的电路层，并且具有嵌入在绝缘层中的连接焊盘，使得 所述连接垫与所述绝缘层的表面齐平，以及被配置为保护所述电路层免受外部环境并且具有所述连接焊盘暴露的开口的绝缘材料。 该制造方法包括将电路层和绝缘材料压入绝缘层中以形成水平表面，同时使连接垫在表面平齐的步骤。 该方法使印刷电路板变薄，提高了可靠性和设计自由度。

公开(公告)号：US20100175915A1

公开(公告)日：2010-07-15

申请号：US12385003

申请日：2009-03-27

申请人： Jee Soo Mok ,  Je Gwang Yoo ,  Chang Sup Ryu

发明人： Jee Soo Mok ,  Je Gwang Yoo ,  Chang Sup Ryu

IPC分类号： H05K1/00 ,  H05K3/34

CPC分类号： H05K3/4069 ,  H05K3/06 ,  H05K3/107 ,  H05K3/28 ,  H05K3/4647 ,  H05K2201/0355 ,  H05K2201/0376 ,  H05K2201/09481 ,  H05K2203/0278 ,  H05K2203/1461 ,  Y10T29/49144 ,  Y10T29/49155

摘要： The invention relates to a printed circuit board and a method of manufacturing the printed circuit board, in which the printed circuit board includes an insulating layer, a circuit layer embedded in the insulating layer and having a connection pad that is embedded in the insulating layer such that one side of the connection pad is flush with a surface of the insulating layer, and insulating materials configured to protect the circuit layer from an external environment and having an opening through which the connection pad is exposed. The invention makes the printed circuit board slim, and increases reliability and the degree of design freedom.

摘要翻译： 本发明涉及一种印刷电路板及印刷电路板的制造方法，其中印刷电路板包括绝缘层，嵌入绝缘层中的电路层，并具有嵌入绝缘层中的连接焊盘，例如 连接焊盘的一侧与绝缘层的表面齐平，以及被配置为保护电路层免受外部环境的绝缘材料，并具有连接焊盘暴露的开口。 本发明使得印刷电路板变薄，提高了可靠性和设计自由度。