Invention Grant
- Patent Title: High-voltage semiconductor device
- Patent Title (中): 高压半导体器件
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Application No.: US13169008Application Date: 2011-06-26
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Publication No.: US08592905B2Publication Date: 2013-11-26
- Inventor: Shih-Chieh Pu , Ching-Ming Lee , Wei-Lun Hsu , Chih-Chung Wang , Ke-Feng Lin
- Applicant: Shih-Chieh Pu , Ching-Ming Lee , Wei-Lun Hsu , Chih-Chung Wang , Ke-Feng Lin
- Applicant Address: TW Science-Based Industrial Park, Hsin-Chu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Science-Based Industrial Park, Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
A high-voltage semiconductor device is disclosed. The HV semiconductor device includes: a substrate; a well of first conductive type disposed in the substrate; a first doping region of second conductive type disposed in the p-well; a first isolation structure disposed in the well of first conductive type and surrounding the first doping region of second conductive type; and a first drift ring of second conductive type disposed between the first doping region of second conductive type and the first isolation structure.
Public/Granted literature
- US20120326266A1 HIGH-VOLTAGE SEMICONDUCTOR DEVICE Public/Granted day:2012-12-27
Information query
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