High-voltage semiconductor device
    1.
    发明授权
    High-voltage semiconductor device 有权
    高压半导体器件

    公开(公告)号:US08592905B2

    公开(公告)日:2013-11-26

    申请号:US13169008

    申请日:2011-06-26

    IPC分类号: H01L29/66

    摘要: A high-voltage semiconductor device is disclosed. The HV semiconductor device includes: a substrate; a well of first conductive type disposed in the substrate; a first doping region of second conductive type disposed in the p-well; a first isolation structure disposed in the well of first conductive type and surrounding the first doping region of second conductive type; and a first drift ring of second conductive type disposed between the first doping region of second conductive type and the first isolation structure.

    摘要翻译: 公开了一种高压半导体器件。 HV半导体装置包括:基板; 设置在基板中的第一导电类型的阱; 布置在p阱中的第二导电类型的第一掺杂区; 第一隔离结构,设置在第一导电类型的阱中,并且包围第二导电类型的第一掺杂区; 以及设置在第二导电类型的第一掺杂区域和第一隔离结构之间的第二导电类型的第一漂移环。

    METHOD FOR FORMING DEEP WELL REGION OF HIGH VOLTAGE DEVICE
    3.
    发明申请
    METHOD FOR FORMING DEEP WELL REGION OF HIGH VOLTAGE DEVICE 审中-公开
    形成高压设备深部区域的方法

    公开(公告)号:US20090111252A1

    公开(公告)日:2009-04-30

    申请号:US11928133

    申请日:2007-10-30

    IPC分类号: H01L21/265

    摘要: A method of fabricating a deep well region of a high voltage device is provided. The method includes designating a deep well region that includes a designated highly doped region and a designed scarcely doped region in a substrate. A mask layer, which covers a periphery of the designated deep well region, is formed over the substrate, wherein the mask layer includes a plurality of shielding parts to cover a portion of the designated scarcely doped region. Using the mask layer as an implantation mask, an ion implantation process is performed to implant dopants into the substrate exposed by the mask and to form a plurality of undoped regions in the designated scarcely doped region covered by the shielding parts. The dopants in the designated scarcely doped region are then induced to diffuse to the undoped regions.

    摘要翻译: 提供一种制造高压器件的深阱区域的方法。 该方法包括指定深阱区域,其包括指定的高掺杂区域和在衬底中设计的几乎不掺杂的区域。 覆盖指定的深阱区域的周边的掩模层形成在衬底上,其中掩模层包括多个屏蔽部分以覆盖指定的几乎不掺杂区域的一部分。 使用掩模层作为注入掩模,执行离子注入工艺以将掺杂剂注入到由掩模暴露的衬底中,并在由屏蔽部分覆盖的指定的几乎不掺杂的区域中形成多个未掺杂的区域。 然后诱导指定的稀少掺杂区域中的掺杂剂扩散到未掺杂的区域。

    CONNECTION METHOD AND MANAGEMENT SERVER
    5.
    发明申请
    CONNECTION METHOD AND MANAGEMENT SERVER 有权
    连接方法与管理服务器

    公开(公告)号:US20140324950A1

    公开(公告)日:2014-10-30

    申请号:US14257001

    申请日:2014-04-21

    IPC分类号: H04L29/06

    摘要: A connection method and a management server are provided. Each electronic apparatus detects connection behavior supported by a network, where the electronic apparatus is located, through the management server and accordingly generates a corresponding connection profile and stores it to the management server. The management server reads two connection profiles corresponding to two electronic apparatuses when the management server receives a connection request desired to connect from one of the electronic apparatuses to another one, and dynamically adjusts a plurality of connection detection procedures based on a connection success/failure record. The management server tests the connection detection procedures to determine whether a connection can be established between the two electronic apparatuses so as to obtain a session profile for establishing the connection.

    摘要翻译: 提供连接方法和管理服务器。 每个电子设备通过管理服务器检测由电子设备所在的网络支持的连接行为,并且相应地生成对应的连接简档并将其存储到管理服务器。 管理服务器在管理服务器收到希望从电子设备之一连接的连接请求到另一电子设备时,读取与两个电子设备对应的两个连接简档,并且基于连接成功/失败记录来动态地调整多个连接检测过程 。 管理服务器测试连接检测过程以确定是否可以在两个电子设备之间建立连接,以便获得用于建立连接的会话简档。

    Lateral-diffusion metal-oxide semiconductor device
    6.
    发明授权
    Lateral-diffusion metal-oxide semiconductor device 有权
    横向扩散金属氧化物半导体器件

    公开(公告)号:US08575691B2

    公开(公告)日:2013-11-05

    申请号:US12730245

    申请日:2010-03-24

    IPC分类号: H01L29/66

    摘要: A method for fabricating a lateral-diffusion metal-oxide semiconductor (LDMOS) device is disclosed. The method includes the steps of: providing a semiconductor substrate; forming a first region and a second region both having a first conductive type in the semiconductor substrate, wherein the first region not contacting the second region; and performing a thermal process to diffuse the dopants within the first region and the second region into the semiconductor substrate to form a deep well, wherein the doping concentration of the deep well is less than the doping concentration of the first region and the second region.

    摘要翻译: 公开了一种用于制造横向扩散金属氧化物半导体(LDMOS)器件的方法。 该方法包括以下步骤:提供半导体衬底; 在所述半导体衬底中形成具有第一导电类型的第一区域和第二区域,其中所述第一区域不接触所述第二区域; 以及执行热处理以将所述第一区域和所述第二区域内的掺杂剂扩散到所述半导体衬底中以形成深阱,其中所述深阱的掺杂浓度小于所述第一区域和所述第二区域的掺杂浓度。

    METHOD FOR OPERATING SEMICONDUCTOR DEVICE
    8.
    发明申请
    METHOD FOR OPERATING SEMICONDUCTOR DEVICE 有权
    操作半导体器件的方法

    公开(公告)号:US20120038414A1

    公开(公告)日:2012-02-16

    申请号:US13282482

    申请日:2011-10-27

    IPC分类号: G05F3/02

    摘要: A method for operating a semiconductor device including a lateral double diffused metal oxide semiconductor (LDMOS) with a first source, a common drain and a first gate, a junction field effect transistor (JFET) with a second source, the common drain and a second gate wherein the second source is electrically connected to the first gate and an inner circuit electrically connected to the first source is provided. The first source provides the inner circuit with an inner current to generate an inner voltage by means of the lateral double diffused metal oxide semiconductor, and the lateral double diffused metal oxide semiconductor turns off when the inner voltage is elevated substantially as high as the first gate voltage.

    摘要翻译: 一种用于操作包括具有第一源极,公共漏极和第一栅极的横向双扩散金属氧化物半导体(LDMOS)的半导体器件的方法,具有第二源极的结型场效应晶体管(JFET),所述公共漏极和第二源极 栅极,其中第二源极电连接到第一栅极,并且提供与第一源电连接的内部电路。 第一源为内部电路提供内部电流,以通过横向双扩散金属氧化物半导体产生内部电压,并且当内部电压升高到与第一栅极高相同时,横向双扩散金属氧化物半导体截止 电压。

    Semiconductor device and method for operating the same
    9.
    发明授权
    Semiconductor device and method for operating the same 有权
    半导体装置及其操作方法

    公开(公告)号:US08072011B2

    公开(公告)日:2011-12-06

    申请号:US12573884

    申请日:2009-10-06

    IPC分类号: H01L29/80 H01L31/112

    摘要: A semiconductor device includes a lateral double diffused metal oxide semiconductor (LDMOS) , a junction field effect transistor (JFET) and an inner circuit. The lateral double diffused metal oxide semiconductor includes a first source, a common drain and a first gate. The junction field effect transistor includes a second source, the common drain and a second gate. The second source is electrically connected to the first gate. The inner circuit is electrically connected to the first source.

    摘要翻译: 半导体器件包括横向双扩散金属氧化物半导体(LDMOS),结型场效应晶体管(JFET)和内部电路。 横向双扩散金属氧化物半导体包括第一源极,公共漏极和第一栅极。 结型场效应晶体管包括第二源极,公共漏极和第二栅极。 第二源电连接到第一栅极。 内部电路电连接到第一源。

    Method for forming capacitor of a DRAM having a wall protection structure
    10.
    发明授权
    Method for forming capacitor of a DRAM having a wall protection structure 失效
    一种用于形成具有壁保护结构的DRAM的电容器的方法

    公开(公告)号:US06455371B1

    公开(公告)日:2002-09-24

    申请号:US09783867

    申请日:2001-02-15

    IPC分类号: H01L218242

    CPC分类号: H01L27/10852 H01L28/60

    摘要: The present invention provides a method for forming capacitor of a dynamic random access memory cell. The method comprises providing a substrate and the word line structures formed thereon. A first dielectric layer is deposited on the substrate and the word line structures. A first polysilicon layer is deposited to form bit line contacts and bit lines. A second dielectric layer is formed on the first dielectric layer and the bit lines. The partial second dielectric layer is removed to form at least a wall structure in the second dielectric layer. The partial second dielectric layer and partial first dielectric layer are removed to form a capacitor contact opening. A second polysilicon is deposited into the capacitor contact opening and on the wall structure and the second dielectric layer. The partial second polysilicon is removed to form a capacitor node whereby a side-wall of the capacitor node is adjacent to the wall structure.

    摘要翻译: 本发明提供一种用于形成动态随机存取存储单元的电容器的方法。 该方法包括提供衬底和其上形成的字线结构。 第一电介质层沉积在衬底和字线结构上。 沉积第一多晶硅层以形成位线触点和位线。 在第一电介质层和位线上形成第二电介质层。 去除部分第二介电层以在第二介电层中形成至少一个壁结构。 去除部分第二电介质层和部分第一介电层以形成电容器接触开口。 第二多晶硅沉积到电容器接触开口中以及壁结构和第二介电层上。 去除部分第二多晶硅以形成电容器节点,由此电容器节点的侧壁与壁结构相邻。