Invention Grant
- Patent Title: Measuring method, measuring apparatus, lithographic apparatus and device manufacturing method
- Patent Title (中): 测量方法,测量仪器,光刻设备和器件制造方法
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Application No.: US13369614Application Date: 2012-02-09
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Publication No.: US08593646B2Publication Date: 2013-11-26
- Inventor: Arie Jeffrey Den Boef , Marcel Hendrikus Maria Beems , Theodorus Petrus Maria Cadee , Raymond Wilhelmus Louis Lafarre
- Applicant: Arie Jeffrey Den Boef , Marcel Hendrikus Maria Beems , Theodorus Petrus Maria Cadee , Raymond Wilhelmus Louis Lafarre
- Applicant Address: NL Veldhoven
- Assignee: ASML Netherlands B.V.
- Current Assignee: ASML Netherlands B.V.
- Current Assignee Address: NL Veldhoven
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- Main IPC: G01B11/14
- IPC: G01B11/14 ; G01B11/00

Abstract:
An apparatus (AS) measures positions of marks (202) on a lithographic substrate (W). A measurement optical system comprises illumination subsystem (504) for illuminating the mark with a spot of radiation (206) and as detecting subsystem (580) for detecting radiation diffracted by the mark. The substrate and measurement optical system move relative to one another at a first velocity (vW) so as to scan the mark while synchronously moving the spot of radiation relative to the reference frame (RF) of the measurement optical system at a second velocity (vSPOT). The spot scans the mark at a third velocity (vEFF) which is lower than the first velocity to allow more time for accurate position measurements to be acquired. In one embodiment, an objective lens (524) remains fixed in relation to the reference frame while a moving optical element (562) imparts the movement of the radiation spot relative to the reference frame.
Public/Granted literature
- US20120212749A1 Measuring Method, Measuring Apparatus, Lithographic Apparatus and Device Manufacturing Method Public/Granted day:2012-08-23
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