发明授权
- 专利标题： Soldering material and electronic component assembly
- 专利标题（中）： 焊料和电子元器件组装
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申请号： US12999411申请日： 2010-04-19
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公开(公告)号： US08598464B2公开(公告)日： 2013-12-03
- 发明人: Shigeaki Sakatani , Akio Furusawa , Kenichiro Suetsugu , Taichi Nakamura
- 申请人： Shigeaki Sakatani , Akio Furusawa , Kenichiro Suetsugu , Taichi Nakamura
- 申请人地址： JP Osaka
- 专利权人： Panasonic Corporation
- 当前专利权人： Panasonic Corporation
- 当前专利权人地址： JP Osaka
- 代理机构： Wenderoth, Lind & Ponack, L.L.P.
- 优先权： JP2009-101729 20090420
- 国际申请： PCT/JP2010/002812 WO 20100419
- 国际公布： WO2010/122764 WO 20101028
- 主分类号： H05K1/16
- IPC分类号： H05K1/16 ; B23K31/00 ; C22C13/02
摘要：
A solder material includes 1.0-4.0% by weight of Ag, 4.0-6.0% by weight of In, 0.1-1.0% by weight of Bi, 1% by weight or less (excluding 0% by weight) of a sum of one or more elements selected from the group consisting of Cu, Ni, Co, Fe and Sb, and a remainder of Sn. When a copper-containing electrode part of an electronic component is connected to a copper-containing electrode land of a substrate by using this solder material, a part having an excellent stress relaxation property can be formed in the solder-connecting part and a Cu—Sn intermetallic compound can be rapidly grown from the electrode land and the electrode part to form a strong blocking structure.
公开/授权文献
- US20110120769A1 SOLDERING MATERIAL AND ELECTRONIC COMPONENT ASSEMBLY 公开/授权日：2011-05-26
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