Invention Grant
- Patent Title: Method and system for routing electrical connections of semiconductor chips
- Patent Title (中): 路由半导体芯片电气连接的方法和系统
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Application No.: US12871939Application Date: 2010-08-31
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Publication No.: US08598709B2Publication Date: 2013-12-03
- Inventor: Thorsten Meyer , Gottfried Beer , Christian Geissler , Thomas Ort , Klaus Pressel , Bernd Waidhas , Andreas Wolter
- Applicant: Thorsten Meyer , Gottfried Beer , Christian Geissler , Thomas Ort , Klaus Pressel , Bernd Waidhas , Andreas Wolter
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/768
Abstract:
A method and a system for routing electrical connections are disclosed. A semiconductor device includes a first semiconductor chip and a routing plane having a plurality of routing lines. A first connecting line is electrically coupled to the first semiconductor chip and one of the plurality of routing lines and a second connecting line is electrically coupled to the one of the plurality of routing lines and to one of a second semiconductor chip or a first external contact element.
Public/Granted literature
- US08415803B2 Method and system for routing electrical connections of semiconductor chips Public/Granted day:2013-04-09
Information query
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