The present invention has an object to provide a curable composition for transfer materials. The curable composition is applicable to a UV nanoimprint process capable of forming micropatterns with high throughput, is applicable to a thermal nanoimprint process in some cases, and is capable of forming a micropattern having high selectivity on etching rates regarding a fluorine-based gas and an oxygen gas. A curable composition for transfer materials of the present invention contains a curable silicon compound produced by subjecting a silicon compound (A) having a Si—H group and a compound (B) having a curable functional group and a carbon-carbon double bond other than the curable functional group to a hydrosilylation reaction.