Invention Grant
- Patent Title: Lid for micro-electro-mechanical device and method for fabricating the same
- Patent Title (中): 微机电装置用盖及其制造方法
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Application No.: US12604907Application Date: 2009-10-23
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Publication No.: US08610006B2Publication Date: 2013-12-17
- Inventor: Shih-Ping Hsu , Kun-Chen Tsai , Micallaef Ivan
- Applicant: Shih-Ping Hsu , Kun-Chen Tsai , Micallaef Ivan
- Applicant Address: TW Taoyuan
- Assignee: Unimicron Technology Corporation
- Current Assignee: Unimicron Technology Corporation
- Current Assignee Address: TW Taoyuan
- Agency: Edwards Wildman Palmer LLP
- Agent Peter F. Corless; Steven M. Jensen
- Priority: TW97141729A 20081030
- Main IPC: H01L23/28
- IPC: H01L23/28

Abstract:
A lid for a micro-electro-mechanical device and a method for fabricating the same are provided. The lid includes a board with opposite first and second surfaces and a first conductor layer. The first surface has a first metal layer thereon. The first metal layer and the board have a recess formed therein. The recess has a bottom surface and a side surface adjacent thereto. The first conductor layer is formed on the first metal layer and the bottom and side surfaces of the recess. The shielding effect of the side surface of the board is enhanced because of the recess integral to the board, the homogeneous bottom and side surfaces of the recess, and the first conductor layer covering the first metal layer, the bottom and side surfaces of the recess.
Public/Granted literature
- US20100108345A1 LID FOR MICRO-ELECTRO-MECHANICAL DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2010-05-06
Information query
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