公开(公告)号：US20100108345A1

公开(公告)日：2010-05-06

申请号：US12604907

申请日：2009-10-23

申请人： Shih-Ping Hsu ,  Kun-Chen Tsai ,  Micallaef Ivan

发明人： Shih-Ping Hsu ,  Kun-Chen Tsai ,  Micallaef Ivan

IPC分类号： H05K5/00 ,  H05K13/00 ,  B05D5/12

CPC分类号： H05K9/0084 ,  B81B7/0061 ,  B81B7/0064 ,  B81B2201/0257 ,  H04R19/005

摘要： A lid for a micro-electro-mechanical device and a method for fabricating the same are provided. The lid includes a board with opposite first and second surfaces and a first conductor layer. The first surface has a first metal layer thereon. The first metal layer and the board have a recess formed therein. The recess has a bottom surface and a side surface adjacent thereto. The first conductor layer is formed on the first metal layer and the bottom and side surfaces of the recess. The shielding effect of the side surface of the board is enhanced because of the recess integral to the board, the homogeneous bottom and side surfaces of the recess, and the first conductor layer covering the first metal layer, the bottom and side surfaces of the recess. Hence, the shielding effect upon the micro-electro-mechanical device is enhanced.

摘要翻译： 提供了一种微机电装置用盖及其制造方法。 盖子包括具有相对的第一和第二表面的板和第一导体层。 第一表面上具有第一金属层。 第一金属层和板具有形成在其中的凹部。 凹部具有底表面和与其相邻的侧表面。 第一导体层形成在第一金属层和凹部的底部和侧表面上。 板的侧面的屏蔽效果由于与板的整体凹部，凹部的均匀的底部和侧表面以及覆盖第一金属层的第一导体层，凹部的底部和侧表面而增强 。 因此，增强了对微机电装置的屏蔽效果。

公开(公告)号：US08610006B2

公开(公告)日：2013-12-17

申请号：US12604907

申请日：2009-10-23

申请人： Shih-Ping Hsu ,  Kun-Chen Tsai ,  Micallaef Ivan

发明人： Shih-Ping Hsu ,  Kun-Chen Tsai ,  Micallaef Ivan

IPC分类号： H01L23/28

CPC分类号： H05K9/0084 ,  B81B7/0061 ,  B81B7/0064 ,  B81B2201/0257 ,  H04R19/005

摘要： A lid for a micro-electro-mechanical device and a method for fabricating the same are provided. The lid includes a board with opposite first and second surfaces and a first conductor layer. The first surface has a first metal layer thereon. The first metal layer and the board have a recess formed therein. The recess has a bottom surface and a side surface adjacent thereto. The first conductor layer is formed on the first metal layer and the bottom and side surfaces of the recess. The shielding effect of the side surface of the board is enhanced because of the recess integral to the board, the homogeneous bottom and side surfaces of the recess, and the first conductor layer covering the first metal layer, the bottom and side surfaces of the recess.

摘要翻译： 提供了一种微机电装置用盖及其制造方法。 盖子包括具有相对的第一和第二表面的板和第一导体层。 第一表面上具有第一金属层。 第一金属层和板具有形成在其中的凹部。 凹部具有底表面和与其相邻的侧表面。 第一导体层形成在第一金属层和凹部的底部和侧表面上。 板的侧面的屏蔽效果由于与板的整体凹部，凹部的均匀的底部和侧表面以及覆盖第一金属层的第一导体层，凹部的底部和侧表面而增强 。