发明授权
- 专利标题： Three-dimensional LED substrate and LED lighting device
- 专利标题（中）： 三维LED基板和LED照明装置
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申请号： US13640869申请日： 2011-04-14
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公开(公告)号： US08610141B2公开(公告)日： 2013-12-17
- 发明人: Naoya Tohyama , Takuya Inoue , Kouichi Kumagai , Takaha Kunieda
- 申请人： Naoya Tohyama , Takuya Inoue , Kouichi Kumagai , Takaha Kunieda
- 申请人地址： JP Yokohama-Shi
- 专利权人： Liquid Design Systems, Inc.
- 当前专利权人： Liquid Design Systems, Inc.
- 当前专利权人地址： JP Yokohama-Shi
- 代理机构： Coleman Sudol Sapone, P.C.
- 代理商 R. Neil Sudol
- 优先权： JP2010-094486 20100415
- 国际申请： PCT/JP2011/059311 WO 20110414
- 国际公布： WO2011/129415 WO 20111020
- 主分类号： H01L33/08
- IPC分类号： H01L33/08 ; H01L33/64 ; H01L33/62
摘要：
The invention includes one or more LED elements, a silicon substrate on which the LED elements are mounted via micro bumps and internally formed wiring is connected to the micro bumps, a heat insulation organic substrate which is stuck to the opposite side of the LED elements-mounting side of the silicon substrate and has through-holes in which the wiring goes through, a chip-mounting substrate which is stuck to the opposite side of the silicon substrate side of the heat insulation organic substrate and internally formed wiring is connected to wiring in the through-holes of the heat insulation organic substrate, and an LED control circuit chip which is connected to the wiring of the chip-mounting substrate via micro bumps, and mounted via the micro bumps on the opposite side of the heat insulation organic substrate side of the chip-mounting substrate.
公开/授权文献
- US20130026509A1 THREE-DIMENSIONAL LED SUBSTRATE AND LED LIGHTING DEVICE 公开/授权日：2013-01-31
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