摘要:
The invention includes one or more LED elements, a silicon substrate on which the LED elements are mounted via micro bumps and internally formed wiring is connected to the micro bumps, a heat insulation organic substrate which is stuck to the opposite side of the LED elements-mounting side of the silicon substrate and has through-holes in which the wiring goes through, a chip-mounting substrate which is stuck to the opposite side of the silicon substrate side of the heat insulation organic substrate and internally formed wiring is connected to wiring in the through-holes of the heat insulation organic substrate, and an LED control circuit chip which is connected to the wiring of the chip-mounting substrate via micro bumps, and mounted via the micro bumps on the opposite side of the heat insulation organic substrate side of the chip-mounting substrate.
摘要:
The invention includes one or more LED elements, a silicon substrate on which the LED elements are mounted via micro bumps and internally formed wiring is connected to the micro bumps, a heat insulation organic substrate which is stuck to the opposite side of the LED elements-mounting side of the silicon substrate and has through-holes in which the wiring goes through, a chip-mounting substrate which is stuck to the opposite side of the silicon substrate side of the heat insulation organic substrate and internally formed wiring is connected to wiring in the through-holes of the heat insulation organic substrate, and an LED control circuit chip which is connected to the wiring of the chip-mounting substrate via micro bumps, and mounted via the micro bumps on the opposite side of the heat insulation organic substrate side of the chip-mounting substrate.
摘要:
A disposable diaper utilizing graphics to visually confirm whether the waist elastics are properly cut or cut off. A disposable diaper has a skin-facing side and a non-skin-facing side defining front and rear waist members, and includes an inner sheet lying on the skin-facing side, an outer sheet lying on the non-skin-facing side, waist elastics interposed between the inner and outer sheets and extending under a potential contractility in a transverse direction of the front and rear waist members, front and rear inelastic regions in which none of the waist elastics is present and graphic sheets having graphics adapted to be visually recognized through the outer sheet. End portions of the waist elastics interposed between the graphic sheets and the outer sheet extend from the outside of the graphic sheets across opposite side edges of the respective graphic sheets into the respective graphic sheets.
摘要:
It is aimed not to increase contact resistance between a wire and a wire crimping portion even upon being subjected to a thermal cycle. A gold plating layer is formed on a base metal (20) via a nickel plating layer (21) in a terminal contact portion (11) to be held in contact with a mating terminal. A tin plating layer (23) is formed on the base metal (20) without via the nickel plating layer (21) in a wire crimping portion (12) to be crimped and connected to a core (15) of an insulated wire (14).
摘要:
The present invention relates to an optical film produced by stretching a film having a low residual solvent amount in a machine direction followed by heat-treating it at a temperature falling from the glass transition point (Tg) to the melting point (Tm) thereof, which is a cellulose acylate film satisfying the following relations (1) to (6) and containing at least one cellulose acylate and at least one retardation enhancer having an absorption maximum wavelength λmax of from 280 nm to 380 nm: (1) 35 nm≦Re(550)≦75 nm, (2) 85 nm≦Rth(550)≦140 nm, (3) 0 nm
摘要:
A cellulose acylate film that has: an in-plane orientation coefficient fxy and a thickness-direction orientation coefficient fxz falling within a range represented by following relationships; and an in-plane retardation Re (λ) falling within a range of 30 nm≦Re (590)≦200 nm and a thickness-direction retardation Rth (λ) falling within a range of 70 nm≦Rth (590)≦350 nm at 25° C., 60% RH: |fxy|
摘要:
A semiconductor comprises a compound (A) adsorbed on a surface of the semiconductor, the compound (A) having at least one lone electron pair and substantially not undergoing in oxidation-reduction reactions, wherein the presence of the compound (A) negatively changes a flat band potential of the semiconductor with reference to that when the compound is absent.
摘要:
A semiconductor comprises a compound (A) adsorbed on a surface of the semiconductor, the compound (A) having at least one lone electron pair and substantially not undergoing in oxidation-reduction reactions, wherein the presence of the compound (A) negatively changes a flat band potential of the semiconductor with reference to that when the compound is absent.
摘要:
A functional device comprising a semiconductor material, wherein the functional device contains a compound not substantially undergoing oxidation-reduction reaction but having at least one lone electron pair and in which adding the compound negatively changes a flat band potential of the semiconductor material with respect to a case not adding it.
摘要:
In a structure for assembling lamps 30 to 32 and a wire harness for those lamps onto a body ceiling 2 of a vehicle body 1, the lamps 30 to 32 and the wire harness for the lamps are assembled to a sub-frame 25 in advance, and electrically connected to each other in advance. In the assembling work, the sub-frame 25 is assembled to the body ceiling 2 of the vehicle body 1, whereby the lamps 30 to 32 and the wire harness for the lamps are assembled to the body ceiling 2 by one assembling work.