- 专利标题： Compliant interconnects in wafers
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申请号： US12962806申请日： 2010-12-08
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公开(公告)号： US08610264B2公开(公告)日： 2013-12-17
- 发明人: Vage Oganesian , Belgacem Haba , Ilyas Mohammed , Piyush Savalia , Craig Mitchell
- 申请人： Vage Oganesian , Belgacem Haba , Ilyas Mohammed , Piyush Savalia , Craig Mitchell
- 申请人地址： US CA San Jose
- 专利权人： Tessera, Inc.
- 当前专利权人： Tessera, Inc.
- 当前专利权人地址： US CA San Jose
- 代理机构： Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- 主分类号： H01L23/488
- IPC分类号： H01L23/488 ; H01L21/60
摘要：
A microelectronic assembly includes a substrate and an electrically conductive element. The substrate can have a CTE less than 10 ppm/° C., a major surface having a recess not extending through the substrate, and a material having a modulus of elasticity less than 10 GPa disposed within the recess. The electrically conductive element can include a joining portion overlying the recess and extending from an anchor portion supported by the substrate. The joining portion can be at least partially exposed at the major surface for connection to a component external to the microelectronic unit.
公开/授权文献
- US20120146210A1 COMPLIANT INTERCONNECTS IN WAFERS 公开/授权日：2012-06-14
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