A dual containment pod having an outer pod and an inner pod that provides support structure and environmental control means. The inner pod includes a base having a flat, polished surface with protrusions upon which the reticle seats and providing a gap between the reticle and the polished surface. The gap separates the reticle from the flat, polished surface of the base and is dimensioned to inhibit migration of particles into the gap, thereby preventing contamination of sensitive surfaces of the wafer or reticle. The top cover of the inner pod seats on the polished surface proximate a periphery of the base. Moveable reticle engaging pins on the top cover of the inner pod are engaged by the top cover of the outer container when the inner pod is assembled inside the outer pod providing reticle restraint.