发明授权
- 专利标题： Processess and compositions for removing substances from substrates
- 专利标题（中）： 从基材中除去物质的方法和组合物
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申请号： US12891745申请日： 2010-09-27
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公开(公告)号： US08614053B2公开(公告)日： 2013-12-24
- 发明人: Michael Wayne Quillen , Dale Edward O'Dell , Zachary Philip Lee , John Cleaon Moore , Edward Enns McEntire , Spencer Erich Hochstetler , Rodney Scott Armentrout , Richard Dalton Peters , Darryl W. Muck
- 申请人： Michael Wayne Quillen , Dale Edward O'Dell , Zachary Philip Lee , John Cleaon Moore , Edward Enns McEntire , Spencer Erich Hochstetler , Rodney Scott Armentrout , Richard Dalton Peters , Darryl W. Muck
- 申请人地址： US TN Kingsport
- 专利权人： Eastman Chemical Company
- 当前专利权人： Eastman Chemical Company
- 当前专利权人地址： US TN Kingsport
- 代理商 James Klein Leonard; Dennis V. Carmen; Jennifer R. Knight
- 主分类号： G03F7/26
- IPC分类号： G03F7/26 ; G03F7/40 ; C11D7/32 ; G03F7/42
摘要：
Processes associated apparatus and compositions useful for removing organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. Processes are presented that apply a minimum volume of a composition as a coating to the inorganic substrate whereby sufficient heat is added and the organic substances are completely removed by rinsing. The compositions and processes may be suitable for removing and, in some instances, completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices.
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