公开(公告)号：US20120077132A1

公开(公告)日：2012-03-29

申请号：US12891745

申请日：2010-09-27

申请人： Michael Wayne Quillen ,  Dale Edward O'Dell ,  Zachary Philip Lee ,  John Cleaon Moore ,  Spencer Erich Hochstetler ,  Richard Dalton Peters ,  Rodney Scott Armentrout ,  Darryl W. Muck

发明人： Michael Wayne Quillen ,  Dale Edward O'Dell ,  Zachary Philip Lee ,  John Cleaon Moore ,  Spencer Erich Hochstetler ,  Richard Dalton Peters ,  Rodney Scott Armentrout ,  Darryl W. Muck

IPC分类号： G03F7/30

CPC分类号： G03F7/422 ,  G03F7/425 ,  G03F7/426 ,  H01L21/02057 ,  H01L21/31133

摘要： Processes associated apparatus and compositions useful for removing organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. Processes are presented that apply a minimum volume of a composition as a coating to the inorganic substrate whereby sufficient heat is added and the organic substances are completely removed by rinsing. The compositions and processes may be suitable for removing and, in some instances, completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices.

摘要翻译： 提供了可用于从基底去除有机物质的相关设备和组合物的方法，例如电子器件衬底，例如微电子晶片或平板显示器。 给出了将最小体积的组合物作为涂层施加到无机基底上的方法，由此加入足够的热量并通过漂洗完全除去有机物质。 组合物和方法可适用于去除和在一些情况下完全溶解阳性和阴性品种的光致抗蚀剂以及来自电子设备的热固性聚合物。

公开(公告)号：US08614053B2

公开(公告)日：2013-12-24

申请号：US12891745

申请日：2010-09-27

申请人： Michael Wayne Quillen ,  Dale Edward O'Dell ,  Zachary Philip Lee ,  John Cleaon Moore ,  Edward Enns McEntire ,  Spencer Erich Hochstetler ,  Rodney Scott Armentrout ,  Richard Dalton Peters ,  Darryl W. Muck

发明人： Michael Wayne Quillen ,  Dale Edward O'Dell ,  Zachary Philip Lee ,  John Cleaon Moore ,  Edward Enns McEntire ,  Spencer Erich Hochstetler ,  Rodney Scott Armentrout ,  Richard Dalton Peters ,  Darryl W. Muck

IPC分类号： G03F7/26 ,  G03F7/40 ,  C11D7/32 ,  G03F7/42

CPC分类号： G03F7/422 ,  G03F7/425 ,  G03F7/426 ,  H01L21/02057 ,  H01L21/31133

摘要： Processes associated apparatus and compositions useful for removing organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. Processes are presented that apply a minimum volume of a composition as a coating to the inorganic substrate whereby sufficient heat is added and the organic substances are completely removed by rinsing. The compositions and processes may be suitable for removing and, in some instances, completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices.

摘要翻译： 提供了可用于从基底去除有机物质的相关设备和组合物的方法，例如电子器件衬底，例如微电子晶片或平板显示器。 给出了将最小体积的组合物作为涂层施加到无机基底上的方法，由此加入足够的热量并通过漂洗完全除去有机物质。 组合物和方法可适用于去除和在一些情况下完全溶解阳性和阴性品种的光致抗蚀剂以及来自电子设备的热固性聚合物。

公开(公告)号：US20130273479A9

公开(公告)日：2013-10-17

申请号：US12891745

申请日：2010-09-27

申请人： Michael Wayne Quillen ,  Dale Edward O'Dell ,  Zachary Philip Lee ,  John Cleaon Moore ,  Edward Enns McEntire ,  Spencer Erich Hochstetler ,  Richard Dalton Peters ,  Rodney Scott Armentrout ,  Darryl W. Muck

发明人： Michael Wayne Quillen ,  Dale Edward O'Dell ,  Zachary Philip Lee ,  John Cleaon Moore ,  Edward Enns McEntire ,  Spencer Erich Hochstetler ,  Richard Dalton Peters ,  Rodney Scott Armentrout ,  Darryl W. Muck

IPC分类号： G03F7/30

CPC分类号： G03F7/422 ,  G03F7/425 ,  G03F7/426 ,  H01L21/02057 ,  H01L21/31133

摘要： Processes associated apparatus and compositions useful for removing organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. Processes are presented that apply a minimum volume of a composition as a coating to the inorganic substrate whereby sufficient heat is added and the organic substances are completely removed by rinsing. The compositions and processes may be suitable for removing and, in some instances, completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices.

摘要翻译： 提供了可用于从基底去除有机物质的相关设备和组合物的方法，例如电子器件衬底，例如微电子晶片或平板显示器。 给出了将最小体积的组合物作为涂层施加到无机基底上的方法，由此加入足够的热量并通过漂洗完全除去有机物质。 组合物和方法可适用于去除和在一些情况下完全溶解阳性和阴性品种的光致抗蚀剂以及来自电子设备的热固性聚合物。