-
1.发明申请POLYMERIC OR MONOMERIC COMPOSITIONS COMPRISING AT LEAST ONE MONO-AMIDE AND/OR AT LEAST ONE DIAMIDE FOR REMOVING SUBSTANCES FROM SUBSTRATES AND METHODS FOR USING THE SAME 审中-公开包含至少一个单酰胺和/或至少一个二胺的聚合物或单体组合物用于从基底去除物质及其使用方法公开(公告)号：US20120073607A1
公开(公告)日：2012-03-29
申请号：US12891698
申请日：2010-09-27
申请人： Michael Wayne Quillen , Dale Edward O'Dell , Zachary Philip Lee , John Cleaon Moore , Edward Enns McEntire , Spencer Erich Hochstetler
发明人： Michael Wayne Quillen , Dale Edward O'Dell , Zachary Philip Lee , John Cleaon Moore , Edward Enns McEntire , Spencer Erich Hochstetler
CPC分类号： C09D4/06 , C09D9/005 , C11D3/378 , C11D7/263 , C11D7/3218 , C11D11/0047 , C11D11/0058
摘要： Compositions and methods useful for removing organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. Methods are presented that apply a minimum volume of a composition as a coating to the inorganic substrate whereby sufficient heat is added and immediately rinsed with water to achieve complete removal. The compositions and methods may be suitable for removing and completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices.
摘要翻译： 提供了可用于从基板去除有机物质的组合物和方法，例如电子器件基底如微电子晶片或平板显示器。 给出了将最小体积的组合物作为涂层施加到无机基底上的方法，由此加入足够的热量并立即用水冲洗以实现完全去除。 组合物和方法可适用于除去和完全溶解正极和负极品种的光致抗蚀剂以及来自电子器件的热固性聚合物。
-
公开(公告)号：US20100242998A1
公开(公告)日：2010-09-30
申请号：US12413085
申请日：2009-03-27
CPC分类号： C08L81/00 , C11D7/34 , C11D7/5022 , C11D11/0047 , G03F7/423 , G03F7/425 , G03F7/426
摘要： Compositions and methods useful for the removal of organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. A method is presented which applies a minimum volume of the composition as a coating to the inorganic substrate whereby sufficient heat is added and immediately rinsed with water to achieve complete removal. These compositions and methods are particularly suitable for removing and completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices.
摘要翻译： 提供了可用于从基底去除有机物质的组合物和方法，例如电子器件基底如微电子晶片或平板显示器。 提出了一种方法，其将组合物的最小体积作为涂层施加到无机基底上，由此添加足够的热量并立即用水冲洗以实现完全去除。 这些组合物和方法特别适用于从电子装置中除去和完全溶解正极和负极品种的光致抗蚀剂以及热固性聚合物。
-
公开(公告)号：US08614053B2
公开(公告)日：2013-12-24
申请号：US12891745
申请日：2010-09-27
申请人： Michael Wayne Quillen , Dale Edward O'Dell , Zachary Philip Lee , John Cleaon Moore , Edward Enns McEntire , Spencer Erich Hochstetler , Rodney Scott Armentrout , Richard Dalton Peters , Darryl W. Muck
发明人： Michael Wayne Quillen , Dale Edward O'Dell , Zachary Philip Lee , John Cleaon Moore , Edward Enns McEntire , Spencer Erich Hochstetler , Rodney Scott Armentrout , Richard Dalton Peters , Darryl W. Muck
CPC分类号： G03F7/422 , G03F7/425 , G03F7/426 , H01L21/02057 , H01L21/31133
摘要： Processes associated apparatus and compositions useful for removing organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. Processes are presented that apply a minimum volume of a composition as a coating to the inorganic substrate whereby sufficient heat is added and the organic substances are completely removed by rinsing. The compositions and processes may be suitable for removing and, in some instances, completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices.
摘要翻译： 提供了可用于从基底去除有机物质的相关设备和组合物的方法，例如电子器件衬底，例如微电子晶片或平板显示器。 给出了将最小体积的组合物作为涂层施加到无机基底上的方法，由此加入足够的热量并通过漂洗完全除去有机物质。 组合物和方法可适用于去除和在一些情况下完全溶解阳性和阴性品种的光致抗蚀剂以及来自电子设备的热固性聚合物。
-
公开(公告)号：US20120108486A1
公开(公告)日：2012-05-03
申请号：US13346877
申请日：2012-01-10
申请人： Michael Wayne Quillen , Dale Edward O'Dell , Zachary Philip Lee , John Cleaon Moore , Edward Enns McEntire
发明人： Michael Wayne Quillen , Dale Edward O'Dell , Zachary Philip Lee , John Cleaon Moore , Edward Enns McEntire
IPC分类号： G03F7/42
CPC分类号： C08L81/00 , C11D7/34 , C11D7/5022 , C11D11/0047 , G03F7/423 , G03F7/425 , G03F7/426
摘要： Compositions and methods useful for the removal of organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. A method is presented which applies a minimum volume of the composition as a coating to the inorganic substrate whereby sufficient heat is added and immediately rinsed with water to achieve complete removal. These compositions and methods are particularly suitable for removing and completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices.
摘要翻译： 提供了可用于从基底去除有机物质的组合物和方法，例如电子器件基底如微电子晶片或平板显示器。 提出了一种方法，其将组合物的最小体积作为涂层施加到无机基底上，由此添加足够的热量并立即用水冲洗以实现完全去除。 这些组合物和方法特别适用于从电子装置中除去和完全溶解正极和负极品种的光致抗蚀剂以及热固性聚合物。
-
公开(公告)号：US20120077132A1
公开(公告)日：2012-03-29
申请号：US12891745
申请日：2010-09-27
申请人： Michael Wayne Quillen , Dale Edward O'Dell , Zachary Philip Lee , John Cleaon Moore , Spencer Erich Hochstetler , Richard Dalton Peters , Rodney Scott Armentrout , Darryl W. Muck
发明人： Michael Wayne Quillen , Dale Edward O'Dell , Zachary Philip Lee , John Cleaon Moore , Spencer Erich Hochstetler , Richard Dalton Peters , Rodney Scott Armentrout , Darryl W. Muck
IPC分类号： G03F7/30
CPC分类号： G03F7/422 , G03F7/425 , G03F7/426 , H01L21/02057 , H01L21/31133
摘要： Processes associated apparatus and compositions useful for removing organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. Processes are presented that apply a minimum volume of a composition as a coating to the inorganic substrate whereby sufficient heat is added and the organic substances are completely removed by rinsing. The compositions and processes may be suitable for removing and, in some instances, completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices.
摘要翻译： 提供了可用于从基底去除有机物质的相关设备和组合物的方法，例如电子器件衬底，例如微电子晶片或平板显示器。 给出了将最小体积的组合物作为涂层施加到无机基底上的方法，由此加入足够的热量并通过漂洗完全除去有机物质。 组合物和方法可适用于去除和在一些情况下完全溶解阳性和阴性品种的光致抗蚀剂以及来自电子设备的热固性聚合物。
-
公开(公告)号：US20130273479A9
公开(公告)日：2013-10-17
申请号：US12891745
申请日：2010-09-27
申请人： Michael Wayne Quillen , Dale Edward O'Dell , Zachary Philip Lee , John Cleaon Moore , Edward Enns McEntire , Spencer Erich Hochstetler , Richard Dalton Peters , Rodney Scott Armentrout , Darryl W. Muck
发明人： Michael Wayne Quillen , Dale Edward O'Dell , Zachary Philip Lee , John Cleaon Moore , Edward Enns McEntire , Spencer Erich Hochstetler , Richard Dalton Peters , Rodney Scott Armentrout , Darryl W. Muck
IPC分类号： G03F7/30
CPC分类号： G03F7/422 , G03F7/425 , G03F7/426 , H01L21/02057 , H01L21/31133
摘要： Processes associated apparatus and compositions useful for removing organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. Processes are presented that apply a minimum volume of a composition as a coating to the inorganic substrate whereby sufficient heat is added and the organic substances are completely removed by rinsing. The compositions and processes may be suitable for removing and, in some instances, completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices.
摘要翻译： 提供了可用于从基底去除有机物质的相关设备和组合物的方法，例如电子器件衬底，例如微电子晶片或平板显示器。 给出了将最小体积的组合物作为涂层施加到无机基底上的方法，由此加入足够的热量并通过漂洗完全除去有机物质。 组合物和方法可适用于去除和在一些情况下完全溶解阳性和阴性品种的光致抗蚀剂以及来自电子设备的热固性聚合物。
-
公开(公告)号：US08389455B2
公开(公告)日：2013-03-05
申请号：US13346877
申请日：2012-01-10
申请人： Michael Wayne Quillen , Dale Edward O'Dell , Zachary Philip Lee , John Cleaon Moore , Edward Enns McEntire
发明人： Michael Wayne Quillen , Dale Edward O'Dell , Zachary Philip Lee , John Cleaon Moore , Edward Enns McEntire
CPC分类号： C08L81/00 , C11D7/34 , C11D7/5022 , C11D11/0047 , G03F7/423 , G03F7/425 , G03F7/426
摘要： Compositions and methods useful for the removal of organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. A method is presented which applies a minimum volume of the composition as a coating to the inorganic substrate whereby sufficient heat is added and immediately rinsed with water to achieve complete removal. These compositions and methods are particularly suitable for removing and completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices.
-
公开(公告)号：US08444768B2
公开(公告)日：2013-05-21
申请号：US12413085
申请日：2009-03-27
申请人： Michael Wayne Quillen , Dale Edward O'Dell , Zachary Philip Lee , John Cleaon Moore , Edward Enns McEntire
发明人： Michael Wayne Quillen , Dale Edward O'Dell , Zachary Philip Lee , John Cleaon Moore , Edward Enns McEntire
IPC分类号： G03F7/42
CPC分类号： C08L81/00 , C11D7/34 , C11D7/5022 , C11D11/0047 , G03F7/423 , G03F7/425 , G03F7/426
摘要： Compositions and methods useful for the removal of organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. A method is presented which applies a minimum volume of the composition as a coating to the inorganic substrate whereby sufficient heat is added and immediately rinsed with water to achieve complete removal. These compositions and methods are particularly suitable for removing and completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices.
摘要翻译： 提供了可用于从基底去除有机物质的组合物和方法，例如电子器件基底如微电子晶片或平板显示器。 提出了一种方法，其将组合物的最小体积作为涂层施加到无机基底上，由此添加足够的热量并立即用水冲洗以实现完全去除。 这些组合物和方法特别适用于从电子装置中除去和完全溶解正极和负极品种的光致抗蚀剂以及热固性聚合物。
-
公开(公告)号：US08309502B2
公开(公告)日：2012-11-13
申请号：US12715978
申请日：2010-03-02
申请人： Michael Wayne Quillen , Dale Edward O'Dell , Zachary Philip Lee , John Cleaon Moore , Edward Enns McEntire
发明人： Michael Wayne Quillen , Dale Edward O'Dell , Zachary Philip Lee , John Cleaon Moore , Edward Enns McEntire
IPC分类号： C11D7/50
CPC分类号： C11D11/0047 , C11D3/2068 , C11D3/3472 , C11D3/43 , C11D7/263 , C11D7/34 , C11D7/5022 , G03F7/425 , G03F7/426
摘要： Compositions and methods useful for the removal of organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. A method is presented which applies a minimum volume of the composition as a coating to the inorganic substrate whereby sufficient heat is added and immediately rinsed with water to achieve complete removal. These compositions and methods are particularly suitable for removing and completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices.
摘要翻译： 提供了可用于从基底去除有机物质的组合物和方法，例如电子器件基底如微电子晶片或平板显示器。 提出了一种方法，其将组合物的最小体积作为涂层施加到无机基底上，由此添加足够的热量并立即用水冲洗以实现完全去除。 这些组合物和方法特别适用于从电子装置中除去和完全溶解正极和负极品种的光致抗蚀剂以及热固性聚合物。
-
公开(公告)号：US20100242999A1
公开(公告)日：2010-09-30
申请号：US12715978
申请日：2010-03-02
申请人： Michael Wayne Quillen , Dale Edward O'Dell , Zachary Philip Lee , John Cleaon Moore , Edward Enns McEntire
发明人： Michael Wayne Quillen , Dale Edward O'Dell , Zachary Philip Lee , John Cleaon Moore , Edward Enns McEntire
CPC分类号： C11D11/0047 , C11D3/2068 , C11D3/3472 , C11D3/43 , C11D7/263 , C11D7/34 , C11D7/5022 , G03F7/425 , G03F7/426
摘要： Compositions and methods useful for the removal of organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. A method is presented which applies a minimum volume of the composition as a coating to the inorganic substrate whereby sufficient heat is added and immediately rinsed with water to achieve complete removal. These compositions and methods are particularly suitable for removing and completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices.
-
-
-
-
-
-
-
-
-
搜索结果
10 条记录 (耗时 0.021 秒)
