Invention Grant
US08623512B2 Adhesive composition for stealth dicing of semiconductor, adhesive film, and semiconductor device including the adhesive film
有权
用于半导体隐形切割的粘合剂组合物，粘合剂膜和包括粘合膜的半导体器件
- Patent Title: Adhesive composition for stealth dicing of semiconductor, adhesive film, and semiconductor device including the adhesive film
- Patent Title (中): 用于半导体隐形切割的粘合剂组合物，粘合剂膜和包括粘合膜的半导体器件
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Application No.: US12970045Application Date: 2010-12-16
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Publication No.: US08623512B2Publication Date: 2014-01-07
- Inventor: Ah Ram Pyun , Jae Hyun Cho , Ki Tae Song
- Applicant: Ah Ram Pyun , Jae Hyun Cho , Ki Tae Song
- Applicant Address: KR Gumi-si, Kyeongsangbuk-do
- Assignee: Cheil Industries, Inc.
- Current Assignee: Cheil Industries, Inc.
- Current Assignee Address: KR Gumi-si, Kyeongsangbuk-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2009-0128327 20091221
- Main IPC: B32B27/38
- IPC: B32B27/38 ; C08G59/62 ; C09J163/00 ; H01L21/02
Abstract:
An adhesive composition for stealth dicing of a semiconductor, an adhesive film, and a semiconductor device including the adhesive film, the adhesive composition including a polymer resin, the polymer resin having a glass transition temperature of about 5° C. to about 35° C., an epoxy resin, the epoxy resin including a liquid epoxy resin and a solid epoxy resin, a phenolic resin curing agent, an inorganic filler, a curing catalyst, and a silane coupling agent.
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