Invention Grant
- Patent Title: Semiconductor chips having guard rings and methods of fabricating the same
- Patent Title (中): 具有保护环的半导体芯片及其制造方法
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Application No.: US13741466Application Date: 2013-01-15
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Publication No.: US08623743B2Publication Date: 2014-01-07
- Inventor: Jung-Do Lee , JongKook Kim , SeokWon Lee , Jaesik Lee , Hohyeuk Im , Su-Min Park
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-Si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-Si
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2009-0083632 20090904
- Main IPC: H01L21/78
- IPC: H01L21/78
Abstract:
Provided is a semiconductor chip. The semiconductor chip includes a semiconductor substrate including a main chip region and a scribe lane region surrounding the main chip region. An insulating layer is disposed over the semiconductor substrate. A guard ring is disposed in the insulating layer in the scribe lane region. The guard ring surrounds at least a portion of the main chip region. The guard ring has a brittleness greater than a brittleness of the insulating layer.
Public/Granted literature
- US20130130472A1 SEMICONDUCTOR CHIPS HAVING GUARD RINGS AND METHODS OF FABRICATING THE SAME Public/Granted day:2013-05-23
Information query
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