Invention Grant
- Patent Title: Semiconductor device and method of fabricating the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US13228479Application Date: 2011-09-09
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Publication No.: US08629020B2Publication Date: 2014-01-14
- Inventor: Sang Gi Kim , Jin-Gun Koo , Seong Wook Yoo , Jong-Moon Park , Jin Ho Lee , Kyoung Il Na , Yil Suk Yang , Jongdae Kim
- Applicant: Sang Gi Kim , Jin-Gun Koo , Seong Wook Yoo , Jong-Moon Park , Jin Ho Lee , Kyoung Il Na , Yil Suk Yang , Jongdae Kim
- Applicant Address: KR Daejeon
- Assignee: Electronics & Telecommunications Research Institute
- Current Assignee: Electronics & Telecommunications Research Institute
- Current Assignee Address: KR Daejeon
- Agency: Rabin & Berdo, P.C.
- Priority: KR10-2010-0103907 20101025; KR10-2010-0125025 20101208
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
Provided are a semiconductor device and a method of fabricating the same. The method includes: forming a trench in a semiconductor substrate of a first conductive type; forming a trench dopant containing layer including a dopant of a second conductive type on a sidewall and a bottom surface of the trench; forming a doping region by diffusing the dopant in the trench dopant containing layer into the semiconductor substrate; and removing the trench dopant containing layer.
Public/Granted literature
- US20120098057A1 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2012-04-26
Information query
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