发明授权
- 专利标题: Semiconductor device and method of fabricating the same
- 专利标题(中): 半导体装置及其制造方法
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申请号: US13228479申请日: 2011-09-09
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公开(公告)号: US08629020B2公开(公告)日: 2014-01-14
- 发明人: Sang Gi Kim , Jin-Gun Koo , Seong Wook Yoo , Jong-Moon Park , Jin Ho Lee , Kyoung Il Na , Yil Suk Yang , Jongdae Kim
- 申请人: Sang Gi Kim , Jin-Gun Koo , Seong Wook Yoo , Jong-Moon Park , Jin Ho Lee , Kyoung Il Na , Yil Suk Yang , Jongdae Kim
- 申请人地址: KR Daejeon
- 专利权人: Electronics & Telecommunications Research Institute
- 当前专利权人: Electronics & Telecommunications Research Institute
- 当前专利权人地址: KR Daejeon
- 代理机构: Rabin & Berdo, P.C.
- 优先权: KR10-2010-0103907 20101025; KR10-2010-0125025 20101208
- 主分类号: H01L21/336
- IPC分类号: H01L21/336
摘要:
Provided are a semiconductor device and a method of fabricating the same. The method includes: forming a trench in a semiconductor substrate of a first conductive type; forming a trench dopant containing layer including a dopant of a second conductive type on a sidewall and a bottom surface of the trench; forming a doping region by diffusing the dopant in the trench dopant containing layer into the semiconductor substrate; and removing the trench dopant containing layer.
公开/授权文献
- US20120098057A1 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME 公开/授权日:2012-04-26
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