Invention Grant
- Patent Title: Substrate processing apparatus
- Patent Title (中): 基板加工装置
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Application No.: US12725981Application Date: 2010-03-17
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Publication No.: US08631809B2Publication Date: 2014-01-21
- Inventor: Tetsuya Hamada , Takashi Taguchi
- Applicant: Tetsuya Hamada , Takashi Taguchi
- Applicant Address: JP
- Assignee: Sokudo Co., Ltd.
- Current Assignee: Sokudo Co., Ltd.
- Current Assignee Address: JP
- Agency: Ostrolenk Faber LLP
- Priority: JP2009-066808 20090318
- Main IPC: B08B3/00
- IPC: B08B3/00
Abstract:
An interface block is constituted by a cleaning/drying processing block and a carry-in/carry-out block. The cleaning/drying processing block includes cleaning/drying processing sections and a transport section. The transport section is provided with a transport mechanism. The carry-in/carry-out block is provided with a transport mechanism. The transport mechanism carries substrates in and out of an exposure device.
Public/Granted literature
- US20100236587A1 SUBSTRATE PROCESSING APPARATUS Public/Granted day:2010-09-23
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