Invention Grant
- Patent Title: Electronic component including micro balls
- Patent Title (中): 电子部件包括微球
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Application No.: US13151145Application Date: 2011-06-01
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Publication No.: US08637779B2Publication Date: 2014-01-28
- Inventor: Suresh Upadhyayula , Naveen Kini
- Applicant: Suresh Upadhyayula , Naveen Kini
- Applicant Address: US TX Plano
- Assignee: SanDisk Technologies Inc.
- Current Assignee: SanDisk Technologies Inc.
- Current Assignee Address: US TX Plano
- Agency: Vierra Magen Marcus LLP
- Main IPC: H01L23/488
- IPC: H01L23/488 ; H05K1/11
Abstract:
A system of micro balls is disclosed for coupling an electronic component to a printed circuit board. The micro balls have a small diameter, and each contact pad may include an array of two or more micro balls. An example of a micro ball may include a polymer core, surrounded by a copper layer, which is in turn surrounded by a layer of solder.
Public/Granted literature
- US20120305305A1 ELECTRONIC COMPONENT INCLUDING MICRO BALLS Public/Granted day:2012-12-06
Information query
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