发明授权
- 专利标题: Method of fabricating light-emitting apparatus with improved light extraction efficiency and light-emitting apparatus fabricated using the method
- 专利标题(中): 制造具有改进的光提取效率的发光装置的方法和使用该方法制造的发光装置
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申请号: US13445455申请日: 2012-04-12
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公开(公告)号: US08637881B2公开(公告)日: 2014-01-28
- 发明人: Yu-Sik Kim , Seong-Deok Hwang , Seung-Jae Lee , Sun-Pil Youn
- 申请人: Yu-Sik Kim , Seong-Deok Hwang , Seung-Jae Lee , Sun-Pil Youn
- 申请人地址: KR
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR
- 代理机构: Onello & Mello, LLP
- 优先权: KR10-2008-0111060 20081110
- 主分类号: H01L33/36
- IPC分类号: H01L33/36
摘要:
Provided are a method of fabricating a light-emitting apparatus with improved light extraction efficiency and a light-emitting apparatus fabricated using the method. The method includes: preparing a monocrystalline substrate; forming an intermediate structure on the substrate, the intermediate structure comprising a light-emitting structure which comprises a first conductive pattern of a first conductivity type, a light-emitting pattern, and a second conductive pattern of a second conductivity type stacked sequentially, a first electrode which is electrically connected to the first conductive pattern, and a second electrode which is electrically connected to the second conductive pattern; forming a polycrystalline region, which extends in a horizontal direction, by irradiating a laser beam to the substrate in the horizontal direction such that the laser beam is focused on a beam-focusing point within the substrate; and cutting the substrate in the horizontal direction along the polycrystalline region.
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