发明授权
US08647974B2 Method of fabricating a semiconductor chip with supportive terminal pad
有权
用支撑端子焊盘制造半导体芯片的方法
- 专利标题： Method of fabricating a semiconductor chip with supportive terminal pad
- 专利标题（中）： 用支撑端子焊盘制造半导体芯片的方法
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申请号： US13072554申请日： 2011-03-25
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公开(公告)号： US08647974B2公开(公告)日： 2014-02-11
- 发明人: Roden R. Topacio , Michael Z. Su , Neil McLellan
- 申请人： Roden R. Topacio , Michael Z. Su , Neil McLellan
- 申请人地址： CA Markham US CA Sunnyvale
- 专利权人： ATI Technologies ULC,Advanced Micro Devices, Inc.
- 当前专利权人： ATI Technologies ULC,Advanced Micro Devices, Inc.
- 当前专利权人地址： CA Markham US CA Sunnyvale
- 代理商 Timothy M. Honeycutt
- 主分类号： H01L21/44
- IPC分类号： H01L21/44 ; H01L23/48
摘要：
Various semiconductor chip input/output structures and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes providing a semiconductor chip that has a first conductor pad and a passivation structure. A second conductor pad is fabricated around but not in physical contact with the first conductor pad to leave a gap. The second conductor pad is adapted to protect a portion of the passivation structure.
公开/授权文献
- US20120241985A1 SEMICONDUCTOR CHIP WITH SUPPORTIVE TERMINAL PAD 公开/授权日：2012-09-27
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