发明授权
- 专利标题： Hermetic wafer level packaging
- 专利标题（中）： 密封晶圆级包装
-
申请号： US12846504申请日： 2010-07-29
-
公开(公告)号： US08648468B2公开(公告)日： 2014-02-11
- 发明人: Richard Chu , Martin Liu , Chia-Hua Chu , Yuan-Chih Hsieh , Chung-Hsien Lin , Lan-Lin Chao , Chun-Wen Cheng , Mingo Liu
- 申请人： Richard Chu , Martin Liu , Chia-Hua Chu , Yuan-Chih Hsieh , Chung-Hsien Lin , Lan-Lin Chao , Chun-Wen Cheng , Mingo Liu
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Haynes and Boone, LLP
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
Provided is a wafer level packaging. The packaging includes a first semiconductor wafer having a transistor device and a first bonding layer that includes a first material. The packaging includes a second semiconductor wafer having a second bonding layer that includes a second material different from the first material, one of the first and second materials being aluminum -based, and the other thereof being titanium-based. Wherein a portion of the second wafer is diffusively bonded to the first wafer through the first and second bonding layers.
公开/授权文献
- US20120025389A1 Hermetic Wafer Level Packaging 公开/授权日：2012-02-02
信息查询
IPC分类:
