Invention Grant
US08653576B2 Method of fabricating a SONOS gate structure with dual-thickness oxide
有权
制造具有双重厚度氧化物的SONOS栅极结构的方法
- Patent Title: Method of fabricating a SONOS gate structure with dual-thickness oxide
- Patent Title (中): 制造具有双重厚度氧化物的SONOS栅极结构的方法
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Application No.: US12648598Application Date: 2009-12-29
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Publication No.: US08653576B2Publication Date: 2014-02-18
- Inventor: Tzyh-Cheang Lee , Jiunn-Ren Hwang , Tsung-Lin Lee
- Applicant: Tzyh-Cheang Lee , Jiunn-Ren Hwang , Tsung-Lin Lee
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L29/76
- IPC: H01L29/76

Abstract:
A method of forming a SONOS gate structure. The method includes forming a gate pattern with sidewalls on a substrate, wherein the gate pattern includes a gate dielectric layer patterned on the substrate and a gate electrode patterned on the gate dielectric layer, forming a first oxide layer on the gate pattern and the substrate; etching back the first oxide layer to expose the substrate and the top of the gate electrode, leaving oxide spacers along the sidewalls of the gate pattern respectively; forming a second oxide layer on the substrate and the oxide spacers; and forming trapping dielectric spacers on the second oxide layer adjacent to the sidewalls of the gate pattern respectively.
Public/Granted literature
- US20100136779A1 Sidewall SONOS Gate Structure with Dual-Thickness Oxide and Method of Fabricating the Same Public/Granted day:2010-06-03
Information query
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