Invention Grant
- Patent Title: Inspecting method and inspecting apparatus for substrate surface
- Patent Title (中): 基板表面检查方法及检查装置
-
Application No.: US13672742Application Date: 2012-11-09
-
Publication No.: US08654350B2Publication Date: 2014-02-18
- Inventor: Akira Hamamatsu , Yoshimasa Oshima , Shunji Maeda , Hisae Shibuya , Yuta Urano , Toshiyuki Nakao , Shigenobu Maruyama
- Applicant: Akira Hamamatsu , Yoshimasa Oshima , Shunji Maeda , Hisae Shibuya , Yuta Urano , Toshiyuki Nakao , Shigenobu Maruyama
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2008-134945 20080523; JP2008-263397 20081010
- Main IPC: G01B11/30
- IPC: G01B11/30

Abstract:
An inspecting method and apparatus for inspecting a substrate surface includes illuminating a light to the substrate surface having a film, detection of a scattered light or reflected light from a plurality of positions of the substrate surface to obtain a plurality of electrical signals, comparison of the plurality of electrical signals and a database which indicates a relationship between the electrical signals and surface roughness, and calculation of a surface roughness value based on the result of comparison.
Public/Granted literature
- US20130107247A1 Inspecting Method and Inspecting Apparatus For Substrate Surface Public/Granted day:2013-05-02
Information query