发明授权
- 专利标题: Heat treatment apparatus
- 专利标题(中): 热处理设备
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申请号: US13092650申请日: 2011-04-22
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公开(公告)号: US08658951B2公开(公告)日: 2014-02-25
- 发明人: Tomihiro Yonenaga , Yumiko Kawano
- 申请人: Tomihiro Yonenaga , Yumiko Kawano
- 申请人地址: JP Tokyo
- 专利权人: Tokyo Electron Limited
- 当前专利权人: Tokyo Electron Limited
- 当前专利权人地址: JP Tokyo
- 代理机构: Rothwell, Figg, Ernst & Manbeck, P.C.
- 优先权: JP2008-272781 20081023
- 主分类号: H05B6/10
- IPC分类号: H05B6/10
摘要:
In-plane temperature of each substrate is uniformly controlled at the time of heating substrates placed on a plurality of susceptors, respectively. A heat treatment apparatus is provided with susceptors, i.e., conductive members for placing wafers thereon, having an induction heating body electrically divided into a center portion thereof and a peripheral portion thereof; a quartz boat supporting the susceptors arranged in a row; an induction coil, which is arranged inside a processing chamber to surround the circumference of each of the susceptors and configured such that the temperature of the induction coil can be freely adjusted; and a control unit which performs temperature control by changing the ratio between heat value at the center portion of the induction heating body and that at the peripheral portion, by controlling two high frequency currents of different frequencies to be applied to the induction coil from a high frequency current circuit.
公开/授权文献
- US20110248024A1 HEAT TREATMENT APPARATUS 公开/授权日:2011-10-13