Invention Grant
US08659229B2 Plasma attenuation for uniformity control 有权
用于均匀度控制的等离子体衰减

Plasma attenuation for uniformity control
Abstract:
A plasma processing apparatus and method are disclosed which create a uniform plasma within an enclosure. In one embodiment, a conductive or ferrite material is used to influence a section of the antenna, where a section is made up of portions of multiple coiled segments. In another embodiment, a ferrite material is used to influence a portion of the antenna. In another embodiment, plasma uniformity is improved by modifying the internal shape and volume of the enclosure.
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