Invention Grant
- Patent Title: Reactive hot melt adhesive with improved hydrolysis resistance
- Patent Title (中): 具有改善耐水解性的活性热熔胶
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Application No.: US10408141Application Date: 2003-04-04
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Publication No.: US08664330B2Publication Date: 2014-03-04
- Inventor: Ju-Ming Hung , Wayne K. Chu , Yue S. Zhang , Ingrid Cole
- Applicant: Ju-Ming Hung , Wayne K. Chu , Yue S. Zhang , Ingrid Cole
- Applicant Address: US CT Rocky Hill
- Assignee: Henkel US IP LLC
- Current Assignee: Henkel US IP LLC
- Current Assignee Address: US CT Rocky Hill
- Agent James E. Piotrowski; Steven C. Bauman
- Main IPC: B32B27/00
- IPC: B32B27/00 ; B32B27/40 ; C08F8/30 ; C08F283/04 ; C08G18/00 ; C08G18/08 ; C08G18/28 ; C08J3/00 ; C08K3/20 ; C08L75/00 ; C09J4/00 ; C09J101/00 ; C09J201/00
Abstract:
High green strength reactive hot melt adhesives are prepared using relatively low levels of reactive acrylic, and may be prepared with liquid crystalline or crystalline diols.
Public/Granted literature
- US20040198899A1 Reactive hot melt adhesive with improved hydrolysis resistance Public/Granted day:2004-10-07
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