Invention Grant
- Patent Title: Capillary exchange system of semiconductor wire bonding
- Patent Title (中): 半导体引线接合毛细管交换系统
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Application No.: US13728316Application Date: 2012-12-27
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Publication No.: US08672210B2Publication Date: 2014-03-18
- Inventor: Young Sik Kim , Doo Jin Kim , Sung Bok Hong , Ki Taik Oh
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2012-0020308 20120228
- Main IPC: B23K37/00
- IPC: B23K37/00
Abstract:
A capillary exchange system of a semiconductor wire bonding includes a wire bond unit having a chuck that includes a holding portion for holding a capillary for semiconductor wire bonding, a holding release guide unit for mechanically acting on the chuck of the wire bond unit to allow the capillary to be held by the holding portion or released from the holding portion, and a capillary exchange unit for separating the capillary from the chuck of the wire bond unit and installing a new capillary in the chuck in cooperation with the holding release guide unit.
Public/Granted literature
- US20130221071A1 CAPILLARY EXCHANGE SYSTEM OF SEMICONDUCTOR WIRE BONDING Public/Granted day:2013-08-29
Information query
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