公开(公告)号：US11081374B2

公开(公告)日：2021-08-03

申请号：US16401558

申请日：2019-05-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hee Ju Seo ,  Jae Won Choi ,  Sung Bok Hong ,  Young Jin Hwang

IPC: H01L21/67 ,  H01L21/56 ,  B29C45/58 ,  B29C45/63 ,  B29C45/34

Abstract: A semiconductor package molding device is provided. The semiconductor package molding device includes a chamber lower part which comprises a lower mold configured to receive a molding target, a chamber upper part configured to engage with the chamber lower part to isolate the inside of a chamber from the outside of the chamber, the chamber upper part including an upper mold configured to form a cavity with the lower mold, a first vent hole located between the chamber upper part and the chamber lower part, the first vent hole configured to discharge gas from the inside of the cavity after the chamber upper part and the chamber lower part engage with each other, a pot which is formed in the lower mold in the chamber lower part, a plunger configured to push up a molding material in the pot, a second vent hole which is formed in a side surface of the pot in the chamber lower part and a cavity vacuum pump configured to discharge gas through the first vent hole and the second vent hole.

公开(公告)号：US08672210B2

公开(公告)日：2014-03-18

申请号：US13728316

申请日：2012-12-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young Sik Kim ,  Doo Jin Kim ,  Sung Bok Hong ,  Ki Taik Oh

IPC: B23K37/00

CPC classification number: H01L21/67138 ,  B23K20/005 ,  H01L24/78 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/78308 ,  H01L2924/00014 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/00015

Abstract: A capillary exchange system of a semiconductor wire bonding includes a wire bond unit having a chuck that includes a holding portion for holding a capillary for semiconductor wire bonding, a holding release guide unit for mechanically acting on the chuck of the wire bond unit to allow the capillary to be held by the holding portion or released from the holding portion, and a capillary exchange unit for separating the capillary from the chuck of the wire bond unit and installing a new capillary in the chuck in cooperation with the holding release guide unit.

Abstract translation: 半导体引线接合的毛细管交换系统包括具有卡盘的引线接合单元，该卡盘包括用于保持用于半导体引线接合的毛细管的保持部分，用于机械地作用在引线接合单元的卡盘上的保持释放引导单元， 由保持部保持的毛细管或从保持部分释放的毛细管，以及毛细管交换单元，用于将毛细管与线接合单元的卡盘分离，并与保持释放引导单元配合地将新的毛细管安装在卡盘中。