Invention Grant
- Patent Title: Cell chip and method for manufacturing the same
- Patent Title (中): 电池芯片及其制造方法
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Application No.: US13482316Application Date: 2012-05-29
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Publication No.: US08673622B2Publication Date: 2014-03-18
- Inventor: Dong Woo Lee , Sang Hyun Yi , Bo Sung Ku
- Applicant: Dong Woo Lee , Sang Hyun Yi , Bo Sung Ku
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon
- Priority: KR10-2011-0051445 20110530
- Main IPC: C12M1/00
- IPC: C12M1/00 ; C12Q1/68 ; G01N33/567 ; G01N33/48 ; C40B40/00 ; C40B40/02 ; C40B50/06
Abstract:
Disclosed herein are a cell chip and a method for manufacturing the same. The cell chip may include: a substrate; and a first contact member disposed on the substrate, wherein a top end of the first contact member is provided with a first inclined contact surface inclined with respect to the substrate.
Public/Granted literature
- US20120309649A1 CELL CHIP AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2012-12-06
Information query
