Invention Grant
US08675188B2 Method and system for determining one or more optical characteristics of structure of a semiconductor wafer
有权
用于确定半导体晶片的结构的一个或多个光学特性的方法和系统
- Patent Title: Method and system for determining one or more optical characteristics of structure of a semiconductor wafer
- Patent Title (中): 用于确定半导体晶片的结构的一个或多个光学特性的方法和系统
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Application No.: US13734506Application Date: 2013-01-04
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Publication No.: US08675188B2Publication Date: 2014-03-18
- Inventor: Xuefeng Liu , Yung-Ho Alex Chuang , John Fielden
- Applicant: KLA-Tencor Corporation
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Corporation
- Current Assignee: KLA-Tencor Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Suiter Swantz pc llo
- Main IPC: G01N21/00
- IPC: G01N21/00 ; G01J4/00

Abstract:
Determination of one or more optical characteristics of a structure of a semiconductor wafer includes measuring one or more optical signals from one or more structures of a sample, determining a background optical field associated with a reference structure having a selected set of nominal characteristics based on the one or more structures, determining a correction optical field suitable for at least partially correcting the background field, wherein a difference between the measured one or more optical signals and a signal associated with a sum of the correction optical field and the background optical field is below a selected tolerance level, and extracting one or more characteristics associated with the one or more structures utilizing the correction optical field.
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