Invention Grant
- Patent Title: Light emitting device package and manufacturing method thereof
- Patent Title (中): 发光器件封装及其制造方法
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Application No.: US13312572Application Date: 2011-12-06
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Publication No.: US08679872B2Publication Date: 2014-03-25
- Inventor: Cheol Jun Yoo , Young Hee Song , Seong Deok Hwang , Sang Hyun Lee
- Applicant: Cheol Jun Yoo , Young Hee Song , Seong Deok Hwang , Sang Hyun Lee
- Applicant Address: KR Suwon-Si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-Si
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2010-0123509 20101206
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L33/60
Abstract:
There is provided a light emitting device package including: a substrate having a circuit pattern formed on at least one surface thereof and including an opening; a wavelength conversion layer formed by filling at least a portion of the opening with a wavelength conversion material; and at least one light emitting device disposed on a surface of the wavelength conversion layer and electrically connected to the circuit pattern.
Public/Granted literature
- US20120138974A1 LIGHT EMITTING DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF Public/Granted day:2012-06-07
Information query
IPC分类:
